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參數(shù)資料
| 型號(hào)： | M68HC001 |
| 廠商： | Motorola, Inc. |
| 英文描述： | 16-/32-Bit Microprocessor(16/32位微處理器) |
| 中文描述： | 16/32位微處理器（16/32位微處理器） |
| 文件頁(yè)數(shù)： | 142/184頁(yè) |
| 文件大小： | 1006K |
| 代理商： | M68HC001 |
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10-2
M68000 8-/16-/32-BIT MICROPROCESSORS USER'S MANUAL
MOTOROLA
10.3 POWER CONSIDERATIONS
The average die-junction temperature, TJ, in
°
C can be obtained from:
TJ = TA+(PD
θ
JA)
where:
(1)
TA
θ
JA
PD
PINT
PI/O
For most applications, PI/O<PINT and can be neglected.
= Ambient Temperature,
°
C
= Package Thermal Resistance, Junction-to-Ambient,
°
C/W
= PINT + PI/O
= ICC x VCC, Watts — Chip Internal Power
= Power Dissipation on Input and Output Pins — User Determined
An appropriate relationship between PD and TJ (if PI/O is neglected) is:
PD = K
÷
(TJ + 273
°
C)
Solving Equations (1) and (2) for K gives:
(2)
K = PD (TA + 273
°
C) +
θ
JA PD
2
where K is a constant pertaining to the particular part. K can be determined from equation
(3) by measuring PD (at thermal equilibrium) for a known TA. Using this value of K, the
values of PD and TJ can be obtained by solving Equations (1) and (2) iteratively for any
value of TA.
(3)
The curve shown in Figure 10-1 gives the graphic solution to the above equations for the
specified power dissipation of 1.5 W over the ambient temperature range of -55
°
C to 125
°
C using a maximum
θ
JA of 45
°
C/W. Ambient temperature is that of the still air
surrounding the device. Lower values of
θ
JA cause the curve to shift downward slightly; for
instance, for
θ
JA of 40
°
/W, the curve is just below 1.4 W at 25
°
C.
The total thermal resistance of a package (
θ
JA) can be separated into two components,
θ
JC and
θ
CA, representing the barrier to heat flow from the semiconductor junction to the
package (case) surface (
θ
JC) and from the case to the outside ambient air (
θ
CA). These
terms are related by the equation:
θ
JA =
θ
JC +
θ
CA
θ
JC is device related and cannot be influenced by the user. However,
θ
CA is user
dependent and can be minimized by such thermal management techniques as heat sinks,
ambient air cooling, and thermal convection. Thus, good thermal management on the part
of the user can significantly reduce
θ
CA so that
θ
JA approximately equals ;
θ
JC.
Substitution of
θ
JC for
θ
JA in equation 1 results in a lower semiconductor junction
temperature.
(4)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| M68EC000 | 16/32 Bit Microprocesso(16/32位微處理器) |
| M68HC16 | 16-Bit Microcontroller(16位微控制器) |
| MAC08BT1 | TRIAC 0.8 AMPERE RMS 200 thru 600 Volts |
| MAC08MT1 | SENSITIVE GATE TRIACS |
| MAC08DT1 | TRIAC 0.8 AMPERE RMS 200 thru 600 Volts |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| M68HC05 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontrollers |
| M68HC05_13 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:M68HC05 Microcontrollers |
| M68HC05EVS | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Motorola M68HC05 Family Evaluation System |
| M68HC05M68H | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:HCMOS Microcontroller Unit |
| M68HC08 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontrollers |
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