參數(shù)資料
型號(hào): M30L0R8000T0ZAQE
廠商: 意法半導(dǎo)體
英文描述: AB 35C 7#12,28#16 PIN RECP
中文描述: 256兆位(16Mb的x16插槽,多銀行,多層次,多突發(fā))1.8V電源快閃記憶體
文件頁數(shù): 61/83頁
文件大?。?/td> 1363K
代理商: M30L0R8000T0ZAQE
61/83
M30L0R8000T0, M30L0R8000B0
Table 38. CFI Query System Interface Information
Offset
Data
Description
Value
01Bh
0017h
V
DD
Logic Supply Minimum Program/Erase or Write voltage
bit 7 to 4 BCD value in volts
bit 3 to 0 BCD value in 100 millivolts
1.7V
01Ch
0020h
V
DD
Logic Supply Maximum Program/Erase or Write voltage
bit 7 to 4 BCD value in volts
bit 3 to 0 BCD value in 100 millivolts
2V
01Dh
0085h
V
PP
[Programming] Supply Minimum Program/Erase voltage
bit 7 to 4 HEX value in volts
bit 3 to 0 BCD value in 100 millivolts
8.5V
01Eh
0095h
V
PP
[Programming] Supply Maximum Program/Erase voltage
bit 7 to 4 HEX value in volts
bit 3 to 0 BCD value in 100 millivolts
9.5V
01Fh
0008h
Typical time-out per single byte/word program = 2
n
μs
256μs
020h
0009h
Typical time-out for Buffer Program = 2
n
μs
512μs
021h
000Ah
Typical time-out per individual block erase = 2
n
ms
1s
022h
0000h
Typical time-out for full chip erase = 2
n
ms
NA
023h
0001h
Maximum time-out for word program = 2
n
times typical
512μs
024h
0001h
Maximum time-out for Buffer Program = 2
n
times typical
1024μs
025h
0002h
Maximum time-out per individual block erase = 2
n
times typical
4s
026h
0000h
Maximum time-out for chip erase = 2
n
times typical
NA
相關(guān)PDF資料
PDF描述
M30L0R8000B0ZAQE 256 Mbit (16Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Flash Memory
M30L0R8000B0ZAQF CAP 0.1UF 50V 10% X7R DIP-2 BULK S-MIL-C-39014
M30L0R8000B0ZAQT 256 Mbit (16Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Flash Memory
M30L0R8000B0ZAQ 256 Mbit (16Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Flash Memory
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參數(shù)描述
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