參數(shù)資料
型號: LPC2930FBD208
廠商: NXP SEMICONDUCTORS
元件分類: 微控制器/微處理器
英文描述: ARM9 flashless microcontroller with CAN, LIN, and USB
中文描述: 32-BIT, MROM, 125 MHz, RISC MICROCONTROLLER, PQFP208
封裝: 28 X 28 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT459-1, LQFP-208
文件頁數(shù): 98/98頁
文件大?。?/td> 643K
代理商: LPC2930FBD208
NXP Semiconductors
LPC2930
ARM9 microcontroller with CAN, LIN, and USB
NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 April 2010
Document identifier: LPC2930_3
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
6.14
Power, Clock and Reset Control SubSystem
(PCRSS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Clock description . . . . . . . . . . . . . . . . . . . . . . 48
Clock Generation Unit (CGU0). . . . . . . . . . . . 49
6.14.2.1 Functional description. . . . . . . . . . . . . . . . . . . 49
6.14.2.2 PLL functional description . . . . . . . . . . . . . . . 52
6.14.2.3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 53
6.14.3
Clock generation for USB (CGU1) . . . . . . . . . 54
6.14.3.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 54
6.14.4
Reset Generation Unit (RGU). . . . . . . . . . . . . 54
6.14.4.1 Functional description. . . . . . . . . . . . . . . . . . . 55
6.14.4.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 55
6.14.5
Power Management Unit (PMU). . . . . . . . . . . 56
6.14.5.1 Functional description. . . . . . . . . . . . . . . . . . . 56
6.15
Vectored interrupt controller . . . . . . . . . . . . . . 58
6.15.1
Functional description. . . . . . . . . . . . . . . . . . . 59
6.15.2
Clock description . . . . . . . . . . . . . . . . . . . . . . 59
7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 60
8
Static characteristics. . . . . . . . . . . . . . . . . . . . 62
8.1
Power consumption . . . . . . . . . . . . . . . . . . . . 68
8.2
Electrical pin characteristics . . . . . . . . . . . . . . 69
9
Dynamic characteristics . . . . . . . . . . . . . . . . . 72
9.1
Dynamic characteristics: I/O and CLK_OUT
pins, internal clock, oscillators, PLL,
and CAN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
9.2
USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 74
9.3
Dynamic characteristics: I
2
C-bus interface. . . 75
9.4
Dynamic characteristics: SPI . . . . . . . . . . . . . 75
9.5
Dynamic characteristics: external static
memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
9.6
Dynamic characteristics: ADC . . . . . . . . . . . . 78
10
Application information. . . . . . . . . . . . . . . . . . 78
10.1
Operating frequency selection . . . . . . . . . . . . 78
10.2
Suggested USB interface solutions . . . . . . . . 80
10.3
SPI signal forms . . . . . . . . . . . . . . . . . . . . . . . 84
10.4
External boot memory interfacing. . . . . . . . . . 85
10.5
XIN_OSC input. . . . . . . . . . . . . . . . . . . . . . . . 87
10.6
XIN_OSC Printed Circuit Board (PCB) layout
guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 89
12
Soldering of SMD packages . . . . . . . . . . . . . . 90
12.1
Introduction to soldering . . . . . . . . . . . . . . . . . 90
12.2
Wave and reflow soldering . . . . . . . . . . . . . . . 90
12.3
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 90
12.4
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 91
13
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 93
14
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
15
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 94
6.14.1
6.14.2
16
16.1
16.2
16.3
16.4
17
18
Legal information . . . . . . . . . . . . . . . . . . . . . . 95
Data sheet status. . . . . . . . . . . . . . . . . . . . . . 95
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Contact information . . . . . . . . . . . . . . . . . . . . 96
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
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