參數(shù)資料
型號(hào)： LPC2926FBD144
廠商： NXP SEMICONDUCTORS
元件分類： 微控制器/微處理器
英文描述： ARM9 microcontroller with CAN, LIN, and USB
中文描述： 32-BIT, FLASH, 125 MHz, RISC MICROCONTROLLER, PQFP144
封裝： 20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT486-1, LQFP-144
文件頁數(shù)： 95/95頁
文件大?。?/td> 1855K
代理商： LPC2926FBD144
NXP Semiconductors
LPC2926/2927/2929
ARM9 microcontroller with CAN, LIN, and USB
NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 September 2010
Document identifier: LPC2926_27_29
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
6.15.6.2 Clock description . . . . . . . . . . . . . . . . . . . . . . 47
6.15.7
Quadrature Encoder Interface (QEI) . . . . . . . 47
6.15.7.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 48
6.15.7.2 Clock description . . . . . . . . . . . . . . . . . . . . . . 48
6.16
Power, Clock and Reset Control Subsystem
(PCRSS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.16.1
Clock description . . . . . . . . . . . . . . . . . . . . . . 49
6.16.2
Clock Generation Unit (CGU0). . . . . . . . . . . . 50
6.16.2.1 Functional description. . . . . . . . . . . . . . . . . . . 50
6.16.2.2 PLL functional description . . . . . . . . . . . . . . . 53
6.16.2.3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 54
6.16.3
Clock generation for USB (CGU1) . . . . . . . . . 55
6.16.3.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 55
6.16.4
Reset Generation Unit (RGU). . . . . . . . . . . . . 55
6.16.4.1 Functional description. . . . . . . . . . . . . . . . . . . 56
6.16.4.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 57
6.16.5
Power Management Unit (PMU). . . . . . . . . . . 57
6.16.5.1 Functional description. . . . . . . . . . . . . . . . . . . 57
6.17
Vectored Interrupt Controller (VIC). . . . . . . . . 59
6.17.1
Functional description. . . . . . . . . . . . . . . . . . . 60
6.17.2
Clock description . . . . . . . . . . . . . . . . . . . . . . 60
7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 61
8
Static characteristics. . . . . . . . . . . . . . . . . . . . 63
8.1
Power consumption . . . . . . . . . . . . . . . . . . . . 68
8.2
Electrical pin characteristics . . . . . . . . . . . . . . 69
9
Dynamic characteristics . . . . . . . . . . . . . . . . . 72
9.1
Dynamic characteristics: I/O and
CLK_OUT pins, internal clock, oscillators,
PLL, and CAN. . . . . . . . . . . . . . . . . . . . . . . . . 72
9.2
USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 74
9.3
Dynamic characteristics: I
2
C-bus interface. . . 75
9.4
Dynamic characteristics: SPI . . . . . . . . . . . . . 76
9.5
Dynamic characteristics: flash memory and
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
9.6
Dynamic characteristics: external static
memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
9.7
Dynamic characteristics: ADC . . . . . . . . . . . . 80
10
Application information. . . . . . . . . . . . . . . . . . 80
10.1
Operating frequency selection . . . . . . . . . . . . 80
10.2
Suggested USB interface solutions . . . . . . . . 82
10.3
SPI signal forms . . . . . . . . . . . . . . . . . . . . . . . 84
10.4
XIN_OSC input. . . . . . . . . . . . . . . . . . . . . . . . 85
10.5
XIN_OSC Printed Circuit Board
(PCB) layout guidelines . . . . . . . . . . . . . . . . . 85
11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 86
12
Soldering of SMD packages . . . . . . . . . . . . . . 87
12.1
Introduction to soldering . . . . . . . . . . . . . . . . . 87
12.2
Wave and reflow soldering . . . . . . . . . . . . . . . 87
12.3
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 87
12.4
13
14
15
16
16.1
16.2
16.3
16.4
17
18
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 88
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 90
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Revision history . . . . . . . . . . . . . . . . . . . . . . . 91
Legal information . . . . . . . . . . . . . . . . . . . . . . 92
Data sheet status. . . . . . . . . . . . . . . . . . . . . . 92
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Contact information . . . . . . . . . . . . . . . . . . . . 93
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
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LPC2926FBD144,557 制造商:NXP Semiconductors 功能描述:LPC2926FBD144/LQFP144/TRAYDPM/ - Trays 制造商:NXP Semiconductors 功能描述:IC MCU ARM9 256KB FLASH 144LQFP
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LPC2927_10 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:ARM9 microcontroller with CAN, LIN, and USB
LPC2927FBD144 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:ARM9 microcontroller with CAN, LIN, and USB
LPC2927FBD144,551 功能描述:ARM微控制器 - MCU ARM968 512K FL/16K RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT
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