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參數(shù)資料
| 型號： | LAN8700 |
| 廠商： | SMSC Corporation |
| 英文描述： | 【15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWR TM in a Small Footprint |
| 中文描述： | 【15kV的ESD保護信息產業(yè)部/ RMII快速的HP Auto - MDIX功能和SMSC flexPWR商標以太網PHY在小尺寸 |
| 文件頁數(shù)： | 64/73頁 |
| 文件大?。?/td> | 457K |
| 代理商： | LAN8700 |
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±15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWR
TM
in a Small Footprint
Datasheet
Revision 1.0 (02-09-07)
64
SMSC LAN8700/LAN8700I
DATASHEET
7.1.1.2
IEC61000-4-2 Performance
The IEC61000-4-2 ESD specification is an international standard that addresses system-level immunity
to ESD strikes while the end equipment is operational. In contrast, the HBM ESD tests are performed
at the device level with the device powered down.
SMSC contracts with Independent laboratories to test the LAN8700 to IEC61000-4-2 in a working
system. Reports are available upon request. Please contact your SMSC representative, and request
information on 3rd party ESD test results. The reports show that systems designed with the LAN8700
can safely dissipate ±15kV air discharges and ±8kV contact discharges per the IEC61000-4-2
specification without additional board level protection.
In addition to defining the ESD tests, IEC 61000-4-2 also categorizes the impact to equipment
operation when the strike occurs (ESD Result Classification). The LAN8700 maintains an ESD Result
Classification 1 or 2 when subjected to an IEC 61000-4-2 (level 4) ESD strike.
Both air discharge and contact discharge test techniques for applying stress conditions are defined by
the IEC61000-4-2 ESD document.
7.1.1.2.1
AIR DISCHARGE
To perform this test, a charged electrode is moved close to the system being tested until a spark is
generated. This test is difficult to reproduce because the discharge is influenced by such factors as
humidity, the speed of approach of the electrode, and construction of the test equipment.
7.1.1.2.2
CONTACT DISCHARGE
The uncharged electrode first contacts the pin to prepare this test, and then the probe tip is energized.
This yields more repeatable results, and is the preferred test method. The independent test laboratories
contracted by SMSC provide test results for both types of discharge methods.
7.1.2
Operating Conditions
7.1.3
Power Consumption
7.1.3.1
Power Consumption Device Only
Power measurements taken over the operating conditions specified. See
Section 5.4.5
for a description
of the power down modes.
Table 7.3 Recommended Operating Conditions
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
COMMENT
VDD33
VDD33 to VSS
3.0
3.3
3.6
V
Input Voltage on
Digital Pins
0.0
VDDIO
V
Voltage on Analog I/O
pins (RXP, RXN)
0.0
+3.6V
V
Ambient Temperature
T
A
LAN8700-AEZG
0
70
C
For Commercial
Temperature
T
A
LAN8700I-AEZG
-40
+85
C
For Industrial Temperature
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| LAN8700AEZG | 制造商:SMSC 功能描述: |
| LAN8700-AEZG | 功能描述:以太網 IC HIPERFRM ETHRNT PHY RoHS:否 制造商:Micrel 產品:Ethernet Switches 收發(fā)器數(shù)量:2 數(shù)據(jù)速率:10 Mb/s, 100 Mb/s 電源電壓-最大:1.25 V, 3.45 V 電源電壓-最小:1.15 V, 3.15 V 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-64 封裝:Tray |
| LAN8700C-AEZG | 功能描述:以太網 IC IC w/HP Auto-MDIX Embedded Ethernet RoHS:否 制造商:Micrel 產品:Ethernet Switches 收發(fā)器數(shù)量:2 數(shù)據(jù)速率:10 Mb/s, 100 Mb/s 電源電壓-最大:1.25 V, 3.45 V 電源電壓-最小:1.15 V, 3.15 V 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-64 封裝:Tray |
| LAN8700C-AEZG-AR2 | 制造商:Microchip Technology Inc 功能描述: 制造商:Microchip Technology Inc 功能描述:MII/RMII 10/100 ETHERNET TRANSCEIVER - Trays 制造商:Microchip Technology Inc 功能描述:TXRX ETHERNET 10/100 36-VQFN 制造商:Microchip Technology Inc 功能描述:Ethernet ICs MII/RMII 10/100 制造商:Microchip Technology Inc 功能描述:MII/RMII 10/100 Ethernet Transceiver, 36 VQFN 6x6x0.9 TRAY |
| LAN8700C-AEZG-TR | 功能描述:以太網 IC Hi Perform Ethernet PHY RoHS:否 制造商:Micrel 產品:Ethernet Switches 收發(fā)器數(shù)量:2 數(shù)據(jù)速率:10 Mb/s, 100 Mb/s 電源電壓-最大:1.25 V, 3.45 V 電源電壓-最小:1.15 V, 3.15 V 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-64 封裝:Tray |
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