參數(shù)資料
型號(hào): LAN8700
廠商: SMSC Corporation
英文描述: 【15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWR TM in a Small Footprint
中文描述: 【15kV的ESD保護(hù)信息產(chǎn)業(yè)部/ RMII快速的HP Auto - MDIX功能和SMSC flexPWR商標(biāo)以太網(wǎng)PHY在小尺寸
文件頁(yè)數(shù): 63/73頁(yè)
文件大?。?/td> 457K
代理商: LAN8700
±15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWR
TM
in a Small Footprint
Datasheet
Chapter 7 DC Electrical Characteristics
SMSC LAN8700/LAN8700I
63
Revision 1.0 (02-09-07)
DATASHEET
7.1
DC Characteristics
7.1.1
Maximum Guaranteed Ratings
Stresses beyond those listed in may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
7.1.1.1
Human Body Model (HBM) Performance
HBM testing verifies the ability to withstand the ESD strikes like those that occur during handling and
manufacturing, and is done without power applied to the IC. To pass the test, the device must have
no change in operation or performance due to the event. All pins on the LAN8700 provide ±8kV HBM
protection.
Table 7.1 Maximum Conditions
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
COMMENT
VDD33,VDDIO
Power pins to all other pins.
-0.5
+3.6
V
Digital IO
To VSS ground
-0.5
+3.6
V
Table 7.5, “MII Bus
Interface Signals,” on
page 66
VSS
VSS to all other pins
-0.5
+4.0
V
Operating
Temperature
LAN8700-AEZG
0
+70
C
Commercial temperature
components.
Operating
Temperature
LAN8700I-AEZG
-40
+85
C
Industrial temperature
components.
Storage
Temperature
-55
+150
C
Table 7.2 ESD and LATCH-UP Performance
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
COMMENTS
ESD PERFORMANCE
All Pins
Human Body Model
±8
kV
Device
System
IED61000-4-2 Contact Discharge
±8
kV
3rd party system test
System
IEC61000-4-2 Air-gap Discharge
±15
kV
3rd party system test
LATCH-UP PERFORMANCE
All Pins
EIA/JESD 78, Class II
150
mA
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