參數(shù)資料
型號(hào): IRF6621
廠商: International Rectifier
英文描述: The IRF6621 combines the latest HEXFET Power MOSFET Silicon technology with the advanced DirectFET packaging to achieve the lowest on-state resistance
中文描述: 該顆IRF6621結(jié)合先進(jìn)的DirectFET封裝,以實(shí)現(xiàn)最低的導(dǎo)通電阻最新的HEXFET功率MOSFET硅技術(shù)
文件頁數(shù): 1/9頁
文件大?。?/td> 254K
代理商: IRF6621
www.irf.com
1
6/6/05
IRF6621
DirectFET
Description
The IRF6621 combines the latest HEXFET Power MOSFET Silicon technology with the advanced DirectFET
TM
packaging to achieve the
lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is compatible
with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering
techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows
dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6621 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching
losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors
operating at higher frequencies. The IRF6621 has been optimized for parameters that are critical in synchronous buck operating from 12 volt
buss converters including Rds(on) and gate charge to minimize losses in the control FET socke
t.
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
SQ
SX
ST
Fig 1.
Typical On-Resistance Vs. Gate Voltage
Fig 2.
Typical Total Gate Charge vs Gate-to-Source Voltage
RoHs Compliant Containing No Lead and Bromide
Low Profile (<0.7 mm)
Dual Sided Cooling Compatible
Ultra Low Package Inductance
Optimized for High Frequency Switching
Ideal for CPU Core DC-DC Converters
Optimized for both Sync.FET and some Control FET
application
Low Conduction and Switching Losses
Compatible with existing Surface Mount Techniques
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
T
C
measured with thermocouple mounted to top (Drain) of part.
Repetitive rating; pulse width limited by max. junction temperature.
Starting T
J
= 25°C, L = 0.29mH, R
G
= 25
, I
AS
= 9.6A.
DirectFET
ISOMETRIC
2.0
4.0
6.0
8.0
10.0
VGS, Gate-to-Source Voltage (V)
5
10
15
20
25
T
)
TJ = 25°C
TJ = 125°C
ID = 12A
0
4
8
12
16
20
24
28
QG Total Gate Charge (nC)
0
2
4
6
8
10
12
VG
VDS= 24V
VDS= 15V
ID= 9.6A
V
DSS
30V max
Q
g tot
V
GS
R
DS(on)
7.0m
@ 10V
Q
gs2
R
DS(on)
9.3m
@ 4.5V
Q
oss
V
gs(th)
±20V max
Q
gd
MQ
MX
MT
MP
Absolute Maximum Ratings
Parameter
Units
V
V
DS
V
GS
I
D
@ T
A
= 25°C
I
D
@ T
A
= 70°C
I
D
@ T
C
= 25°C
I
DM
E
AS
I
AR
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Single Pulse Avalanche Energy
Avalanche Current
A
mJ
A
Max.
30
9.6
55
96
13
9.6
±20
12
Q
rr
11.7nC
4.2nC
1.0nC
10nC
6.9nC
1.8V
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