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參數(shù)資料
| 型號： | intel Pentium CPU |
| 廠商： | Intel Corp. |
| 英文描述： | 32 Bit CPU With MMX Technology and Mobile Module(32位帶MMX和移動模塊處理器) |
| 中文描述： | 32位CPU的MMX技術(shù)和移動模塊（32位帶MMX公司和移動模塊處理器） |
| 文件頁數(shù)： | 32/36頁 |
| 文件大?。?/td> | 395K |
| 代理商： | INTEL PENTIUM CPU |
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INTEL PENTIUM PROCESSOR WITH MMX TECHNOLOGY MOBILE MODULE
32
1/8/98 4:35 PM 24351502.DOC
4.2.
Module Physical Support
Figure 9 shows the Intel Mobile Module standoff
support hole patterns and the board edge
clearance around the perimeter of the module.
These hole locations and board edge clearances
will remain fixed for all Intel Mobile Modules. The
hole patterns and board edge clearance lets the
system manufacturer develop several methods for
mechanically supporting the Intel Mobile Module
within a particular notebook system.
Hole detail, 3 places
Standoff Holes and Board Edge Keepouts (top side)
0.762mm width of EMI containment ring
1.27mm board edge to EMI ring
2.54mm keepout area
3.81+/-0.19mm board edge to hole centerline
3.81+/-0.19mm
4.45mm diameter grounded ring
2.40mm +/- 0.3mm
hole diameter
MMO_009
Figure 9. Standoff Holes, Board Edge Clearance and EMI Containment Ring
The board edge clearance includes a 0.762 mm
(0.030 in) width EMI containment ring around the
perimeter of the module. This ring is on each layer
of the module PCB and is grounded. On the
surface of the module, the metal is exposed for
EMI shielding purposes. The hole patterns placed
on the module also have a plated surrounding ring
and one can use a metal standoff to contact the
ring for EMI shielding purposes. Figure 9 shows
the dimensions of the EMI containment ring and
the keepout area. No components are placed on
the board in the keepout area.
4.3.
Module Mounting
Requirements
Three mounting holes are available to the System
OEM for securing the module to the system base
or the system electronics. See Figure 6 for relative
hole placements. It is strongly recommended the
System OEM utilize mounting screws through all
three of these holes to ensure long term reliability
of the mechanical and EMI integrity of the system.
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