參數(shù)資料
型號(hào)： intel Pentium CPU
廠商： Intel Corp.
英文描述： 32 Bit CPU With MMX Technology and Mobile Module(32位帶MMX和移動(dòng)模塊處理器)
中文描述： 32位CPU的MMX技術(shù)和移動(dòng)模塊（32位帶MMX公司和移動(dòng)模塊處理器）
文件頁(yè)數(shù)： 3/36頁(yè)
文件大?。?/td> 395K
代理商： INTEL PENTIUM CPU
INTEL PENTIUM PROCESSOR WITH MMX TECHNOLOGY MOBILE MODULE
3
1/8/98 4:35 PM 24351502.DOC
CONTENTS
PAGE
PAGE
1.0. INTRODUCTION..............................................4
1.1. A
RCHITECTURE
O
VERVIEW
.............................4
1.2. I
NTEL
M
OBILE
M
ODULE
R
EVISION
I
DENTIFICATION
..............................................5
2.0. MODULE CONNECTOR INTERFACE..........6
2.1. S
IGNAL
D
EFINITIONS
......................................6
2.1.1. MEMORY (108 SIGNALS).....................7
2.1.2. PCI (56 SIGNALS).................................8
2.1.3. PROCESSOR/PIIX4 ISA BRIDGE
SIDEBAND (9 SIGNALS)....................10
2.1.4. POWER MANAGEMENT
(8 SIGNALS)........................................11
2.1.5. CLOCK (8 SIGNALS)..........................12
2.1.6. VOLTAGES (39 SIGNALS).................13
2.1.7. ITP/JTAG (7 SIGNALS).......................14
2.1.8. MISCELLANEOUS (44 SIGNALS)......15
2.2. C
ONNECTOR
P
IN
A
SSIGNMENTS
...................16
2.3. C
ONNECTOR
F
OOTPRINT
..............................18
2.3.1. PIN AND PAD ASSIGNMENT.............18
2.4. C
ONNECTOR
S
PECIFICATIONS
......................19
3.0. FUNCTIONAL DESCRIPTION......................20
3.1. I
NTEL
M
OBILE
M
ODULE
.................................20
3.2. L2 C
ACHE
....................................................20
3.3. 430TX PCI
SET
S
YSTEM
C
ONTROLLER
.........20
3.3.1. MEMORY ORGANIZATION................21
3.3.2. 64-MBIT SDRAM SUPPORT...............21
3.3.3. PCI INTERFACE..................................22
3.4. P
ROCESSOR
C
ORE
V
OLTAGE
R
EGULATION
................................................23
3.4.1. VOLTAGE REGULATOR
EFFICIENCY........................................23
3.4.2. VOLTAGE REGULATOR
CONTROL............................................24
3.4.3. VOLTAGE SIGNAL DEFINITION AND
SEQUENCING.....................................25
Voltage Plane Sequencing...................26
3.5. A
CTIVE
T
HERMAL
F
EEDBACK
........................26
3.6. T
HERMAL
T
RANSFER
P
LATE
..........................27
3.7. M
ODULE
T
HERMAL
R
ESISTANCE
...................27
4.0. MECHANICAL REQUIREMENTS................27
4.1. M
ODULE
D
IMENSIONS
...................................27
4.1.1. BOARD AREA .....................................27
4.1.2. PRINTED CIRCUIT BOARD
THICKNESS...................................................30
4.1.3. HEIGHT RESTRICTIONS...................30
4.2. M
ODULE
P
HYSICAL
S
UPPORT
.......................32
4.3. M
ODULE
M
OUNTING
R
EQUIREMENTS
...........32
4.4. M
ODULE
P
RODUCT
T
RACKING
C
ODE
............34
5.0. ENVIRONMENTAL STANDARDS................35
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