參數(shù)資料
型號(hào)： IBM25EMPPC603EFG-100
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, 100 MHz, RISC PROCESSOR, PQFP240
封裝： 32 X 32 MM, 4.10 MM HEIGHT, 0.50 MM PITCH, FP-240
文件頁(yè)數(shù)： 35/42頁(yè)
文件大?。?/td> 509K
代理商： IBM25EMPPC603EFG-100
40
603e and EM603e Hardware Specification
Appendix A .General Handling Recommendations for
the C4FP Package
The following list provides a few guidelines for package handling:
Handle the electrostatic discharge (ESD) sensitive package with care before, during, and after
processing.
Do not apply any load to exceed 3 Kg after assembly.
Components should not be hot-dip tinned.
The package encapsulation is an acrylated urethane. Use adequate ventilation (local exhaust) for all
elevated temperature processes.
The package parameters are as follows:
Heatsink adhesive
AIEG-7655
IBM reference drawing
99F4869
Test socket
Yamaichi QFP-PO 0.5-240P
Signal
165
Power/ground
75
Total
240
A.1 Package Environmental, Operation, Shipment, and
Storage Requirements
The environmental, operation, shipment, and storage requirements are as follows:
Make sure that the package is suitable for continuous operation under business ofce environments.
— Operating environment: 10
°C to 40°C, 8% to 80% relative humidity
— Storage environment: 1
°C to 60°C, up to 80% relative humidity
— Shipping environment: 40
°C to 60°C, 5% to 100% relative humidity
This component is qualied to meet JEDEC moisture Class 2.
After expiration of shelf life, packages may be baked at 120
°C (+10/–5°C) for 4 hours minimum
and then be used or repackaged. Shelf life is as specied by JEDEC for moisture Class 2
components.
A.2 Card Assembly Recommendations
This section provides recommendations for card assembly process. Follow these guidelines for card
assembly.
This component is supported for aqueous, IR, convection reow, and vapor phase card assembly
processes.
The temperature of packages should not exceed 220
°C for longer than 5 minutes.
The package entering a cleaning cycle must not be exposed to temperature greater than that
occurring during solder reow or hot air exposure.
It is not recommended to re-attach a package that is removed after card assembly.
During the card assembly process, no solvent can be used with the C4FP, and no more than 3 Kg of force
must be applied normal to the top of the package prior to, during, or after card assembly. Other details of
the card assembly process follow:
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