參數(shù)資料
型號(hào)： IBM25EMPPC603EFG-100
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 100 MHz, RISC PROCESSOR, PQFP240
封裝： 32 X 32 MM, 4.10 MM HEIGHT, 0.50 MM PITCH, FP-240
文件頁(yè)數(shù)： 32/42頁(yè)
文件大小： 509K
代理商： IBM25EMPPC603EFG-100
38
603e and EM603e Hardware Specification
1.8.6.2.2 Thermal Management Example
The following example is based on a typical embedded conguration using a solder-bump 21 mm CBGA
package. The heatsink shown is the Thermalloy pinn heatsink #2338 attached directly to the exposed die
with a two-stage thermally conductive epoxy.
The calculations are performed exactly as shown in the previous section.
Figure 17 shows typical thermal performance data for the 21 mm CBGA package mounted to a test card.
Figure 17. CBGA Thermal Management Example
Temperature calculations are also performed identically to those in the previous section. For a power
dissipation of 2.5 Watts in an ambient of 40
°C at 1.0 m/sec, the associated overall thermal resistance and
junction temperature, found in Table 15, will result.
Vendors such as Aavid Engineering Inc., Thermalloy, and Wakeeld Engineering can supply heatsinks with
a wide range of thermal performance. Refer to Section 1.8.6.1.2, “Thermal Management Example,” for
contact information.
Table 15. Thermal Resistance and Junction Temperature
Conguration
θja (°C/W)
Tj (
°C)
Exposed die (no heatsink)
18.4
86
With 2338 heatsink
5.3
53
Approach Air Velocity (m/sec)
0
5
10
15
20
01
2
3
4
θ ja
(
C/W)
IBM CBGA with Exposed Die
25
5
IBM CBGA with Thermalloy
2338B-Pin Fin Heatsink
Assumptions:
1. 2P card with 1 OZ Cu planes
2. 63 mm x 76 mm card
3. Air flow on both sides of card
4. Vertical orientation
5. 2-stage epoxy heat sink attach
相關(guān)PDF資料
PDF描述
IBM25EMPPC603EBG-100 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255
IBM25EMPPC740LDBC4000 32-BIT, 400 MHz, RISC PROCESSOR, CBGA255
IBM25EMPPC750LCBF3330 32-BIT, 333 MHz, RISC PROCESSOR, CBGA360
IBM25EMPPC740LFBF4000 32-BIT, 400 MHz, RISC PROCESSOR, CBGA255
IBM25EMPPC750LDBC4000 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IBM25EMPPC740DBUB2330 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
IBM25EMPPC740DBUB2660 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
IBM25EMPPC740LEBA300 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor
IBM25EMPPC740LEBA333 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor
IBM25EMPPC740LEBA366 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*