參數(shù)資料
型號: HX6218DBNC
元件分類: FIFO
英文描述: 2K X 18 OTHER FIFO, 30 ns, CQFP68
封裝: CERAMIC, QFP-68
文件頁數(shù): 7/15頁
文件大?。?/td> 717K
代理商: HX6218DBNC
FIFO – HX6409/HX6218/HX6136
www.honeywell.com
ORDERING INFORMATION
Package Drawing for 6136 (22018696-001)
H
X
6409
D
S
H
C
INPUT
BUFFER TYPE
C=CMOS Level
T=TTL Level
TOTAL DOSE
HARDNESS
R=1X10
5 rad(Si02)
F=3x10
5 rad(Si02)
H=1x10
6 rad(Si02)
N=No Level Guaranteed
SCREEN LEVEL
S=Level S
B=Level B
E=Engr Device (2)
PACKAGE DESIGN
D=68-Lead CQFP
F=132-Lead CQFP
T=32-Lead CQFP
PART NUMBER
6409 = 4K X 9
6218 = 2K X 18
6136 = 1K X 36
Process
X=SOI
Source
H=Honeywell
(1) Orders may be faxed to 763-954-2051. Please contact our Customer Service Department at 763-954-2888
for further information.
(2) Engineering Device description: Parameters are tested from -55 to 125 C, 24 hr burn-in, no radiation
guaranteed.
Contact Factory with other needs.
Honeywell reserves the right to make changes to any products or technology herein to improve reliability, function or design. Honeywell does not assume any
liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of
others
15
Honeywell International Inc.
12001 Highway 55
Plymouth, MN 55441
1-800-323-8295
www.honeywell.com
Form #900157
September 2005
2005 Honeywell International Inc.
Find out more
For more information about Honeywell’s family of radiation hardened products and technology, visit
www.myspaceparts.com
.
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