參數(shù)資料
型號: HX6218DBNC
元件分類: FIFO
英文描述: 2K X 18 OTHER FIFO, 30 ns, CQFP68
封裝: CERAMIC, QFP-68
文件頁數(shù): 6/15頁
文件大?。?/td> 717K
代理商: HX6218DBNC
FIFO – HX6409/HX6218/HX6136
14
www.honeywell.com
PACKAGING
The FIFO is offered in a 32-lead, 68-lead and a 132-
lead flat pack, depending on the configuration. These
packages are constructed of multilayer ceramic (Al2O3)
and features internal power and ground planes. The flat
packs also feature non-conductive ceramic tie bars.
The tie bars allows electrical testing of the device, while
preserving the lead integrity during shipping and
handling, up to the point of lead forming and insertion.
Package Drawing For 6409 (22020651-001)
Package Drawing For 6218 (22019075-001)
相關(guān)PDF資料
PDF描述
HX6228TBNC 128K X 8 STANDARD SRAM, 25 ns, CDFP32
HX6228TQHC 128K X 8 STANDARD SRAM, 25 ns, CDFP32
HX6228ASNT 128K X 8 STANDARD SRAM, 25 ns, CDFP40
HX6409TQHT 4K X 9 OTHER FIFO, 30 ns, CDFP32
HX80ML 0.02 A, 8000 V, SILICON, SIGNAL DIODE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HX6218DBNT 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x18 Synchronous FIFO
HX6218DBRC 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x18 Synchronous FIFO
HX6218DBRT 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x18 Synchronous FIFO
HX6218DENC 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x18 Synchronous FIFO
HX6218DENT 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x18 Synchronous FIFO