參數(shù)資料
型號(hào)： DSP56303VL100
廠商： Freescale Semiconductor
文件頁數(shù)： 93/108頁
文件大小： 0K
描述： IC DSP 24BIT 100MHZ 196-MAPBGA
標(biāo)準(zhǔn)包裝： 126
系列： DSP563xx
類型： 定點(diǎn)
接口： 主機(jī)接口，SSI，SCI
時(shí)鐘速率： 100MHz
非易失內(nèi)存： ROM（576 B）
芯片上RAM： 24kB
電壓 - 輸入/輸出： 3.30V
電壓 - 核心： 3.30V
工作溫度： -40°C ~ 100°C
安裝類型： 表面貼裝
封裝/外殼： 196-LBGA
供應(yīng)商設(shè)備封裝： 196-MAPBGA（15x15）
包裝： 托盤
DSP56303 Technical Data, Rev. 11
Freescale Semiconductor
4-1
Design Considerations
4
This section describes various areas to consider when incorporating the DSP56303 device into a system design.
4.1 Thermal Design Considerations
An estimate of the chip junction temperature, TJ, in ° C can be obtained from this equation:
Equation 1:
Where:
TA
=
ambient temperature °C
RθJA
=
package junction-to-ambient thermal resistance °C/W
PD
=
power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a case-
to-ambient thermal resistance, as in this equation:
Equation 2:
Where:
RθJA
=
package junction-to-ambient thermal resistance °C/W
RθJC
=
package junction-to-case thermal resistance °C/W
RθCA
=
package case-to-ambient thermal resistance °C/W
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to change
the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around the device, add
a heat sink, change the mounting arrangement on the printed circuit board (PCB) or otherwise change the thermal
dissipation capability of the area surrounding the device on a PCB. This model is most useful for ceramic packages
with heat sinks; some 90 percent of the heat flow is dissipated through the case to the heat sink and out to the
ambient environment. For ceramic packages, in situations where the heat flow is split between a path to the case
and an alternate path through the PCB, analysis of the device thermal performance may need the additional
modeling capability of a system-level thermal simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the
package is mounted. Again, if the estimates obtained from RθJA do not satisfactorily answer whether the thermal
performance is adequate, a system-level model may be appropriate.
A complicating factor is the existence of three common ways to determine the junction-to-case thermal resistance
in plastic packages.
To minimize temperature variation across the surface, the thermal resistance is measured from the junction
to the outside surface of the package (case) closest to the chip mounting area when that surface has a
proper heat sink.
T
J
T
A
P
D
RθJA
×
()
+
=
RθJA
RθJC RθCA
+
=
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