參數(shù)資料
型號： DSP56004ROM
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
元件分類： 數(shù)字信號處理
英文描述： SYMPHONY AUDIO DSP FAMILY 24-BIT DIGITAL SIGNAL PROCESSORS
中文描述： Symphony音頻DSP系列的24位數(shù)字信號處理器
文件頁數(shù)： 9/82頁
文件大?。?/td> 636K
代理商： DSP56004ROM
Signal/Connection Descriptions
Power
MOTOROLA
DSP56004/D, Rev. 3
1-3
POWER
GROUND
Table 1-2
Power Inputs
Power Name
Description
V
CCP
PLL Power
—V
CCP
provides isolated power for the Phase Lock Loop (PLL). The
voltage should be well-regulated and the input should be provided with an
extremely low impedance path to the V
CC
power rail.
Quiet Power
—V
CCQ
provides isolated power for the internal processing logic. This
input must be tied externally to all other chip power inputs. The user must provide
adequate external decoupling capacitors.
V
CCQ
V
CCA
Address Bus Power
—V
CCA
provides isolated power for sections of the address bus
I/ O drivers. This input must be tied externally to all other chip power inputs. The
user must provide adequate external decoupling capacitors.
V
CCD
Data Bus Power
—V
CCD
provides isolated power for sections of the data bus I/ O
drivers. This input must be tied externally to all other chip power inputs. The user
must provide adequate external decoupling capacitors.
V
CCS
Serial Interface Power
—V
CCS
provides isolated power for the SHI and SAI. This
input must be tied externally to all other chip power inputs. The user must provide
adequate external decoupling capacitors.
Table 1-3
Grounds
Ground Name
Description
GND
P
PLL Ground
—GND
P
is ground dedicated for PLL use. The connection should be
provided with an extremely low-impedance path to ground. V
CCP
should be
bypassed to GND
P
by a 0.47
μ
F capacitor located as close as possible to the chip
package.
GND
Q
Quiet Ground
—GND
Q
provides isolated ground for the internal processing logic.
This connection must be tied externally to all other chip ground connections. The
user must provide adequate external decoupling capacitors.
GND
A
Address Bus Ground
—GND
A
provides isolated ground for sections of the address
bus I/ O drivers. This connection must be tied externally to all other chip ground
connections. The user must provide adequate external decoupling capacitors.
GND
D
Data Bus Ground
—GND
D
provides isolated ground for sections of the data bus I/ O
drivers. This connection must be tied externally to all other chip ground
connections. The user must provide adequate external decoupling capacitors.
GND
S
Serial Interface Ground
—GND
S
provides isolated ground for the SHI and SAI. This
connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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