參數(shù)資料
型號: DSP56004ROM
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
元件分類: 數(shù)字信號處理
英文描述: SYMPHONY AUDIO DSP FAMILY 24-BIT DIGITAL SIGNAL PROCESSORS
中文描述: Symphony音頻DSP系列的24位數(shù)字信號處理器
文件頁數(shù): 75/82頁
文件大?。?/td> 636K
代理商: DSP56004ROM
MOTOROLA
DSP56004/D, Rev. 3
4-1
SECTION
4
DESIGN CONSIDERATIONS
THERMAL DESIGN CONSIDERATIONS
An estimation of the chip junction temperature, T
J
, in
°
C can be obtained from the
equation:
Equation 1:
Where:
T
A
= ambient temperature C
R
θ
JA
= package junction-to-ambient thermal resistance C/ W
P
D
= power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case
thermal resistance and a case-to-ambient thermal resistance:
Equation 2:
Where:
R
θ
JA
= package junction-to-ambient thermal resistance C/ W
R
θ
JC
= package junction-to-case thermal resistance C/ W
R
θ
CA
= package case-to-ambient thermal resistance C/ W
R
θ
JC
is device-related and cannot be influenced by the user. The user controls the
thermal environment to change the case-to-ambient thermal resistance, R
θ
CA
. For
example, the user can change the air flow around the device, add a heat sink, change
the mounting arrangement on the Printed Circuit Board, or otherwise change the
thermal dissipation capability of the area surrounding the device on a Printed Circuit
Board. This model is most useful for ceramic packages with heat sinks; some 90% of
the heat flow is dissipated through the case to the heat sink and out to the ambient
environment. For ceramic packages, in situations where the heat flow is split between
a path to the case and an alternate path through the Printed Circuit Board, analysis of
the device thermal performance may need the additional modeling capability of a
system level thermal simulation tool.
T
J
T
A
P
D
R
θ
JA
×
(
)
+
=
R
θ
JA
R
θ
JC
R
θ
CA
+
=
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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