參數(shù)資料
型號(hào)： DSP56004ROM
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
元件分類： 數(shù)字信號(hào)處理
英文描述： SYMPHONY AUDIO DSP FAMILY 24-BIT DIGITAL SIGNAL PROCESSORS
中文描述： Symphony音頻DSP系列的24位數(shù)字信號(hào)處理器
文件頁數(shù)： 76/82頁
文件大小： 636K
代理商： DSP56004ROM
4-2
DSP56004/D, Rev. 3
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
Design Considerations
Thermal Design Considerations
The thermal performance of plastic packages is more dependent on the temperature
of the Printed Circuit Board to which the package is mounted. Again, if the
estimations obtained from R
θ
JA
do not satisfactorily answer whether the thermal
performance is adequate, a system level model may be appropriate.
A complicating factor is the existence of three common ways for determining the
junction-to-case thermal resistance in plastic packages:
To minimize temperature variation across the surface, the thermal resistance
is measured from the junction to the outside surface of the package (case)
closest to the chip mounting area when that surface has a proper heat sink.
To define a value approximately equal to a junction-to-board thermal
resistance, the thermal resistance is measured from the junction to where the
leads are attached to the case.
If the temperature of the package case (T
T
) is determined by a thermocouple,
the thermal resistance is computed using the value obtained by the equation
(T
J
– T
T
)/ P
D
.
As noted above, the junction-to-case thermal resistances quoted in this data sheet are
determined using the first definition. From a practical standpoint, that value is also
suitable for determining the junction temperature from a case thermocouple reading
in forced convection environments. In natural convection, using the junction-to-case
thermal resistance to estimate junction temperature from a thermocouple reading on
the case of the package will estimate a junction temperature slightly hotter than
actual temperature. Hence, the new thermal metric, Thermal Characterization
Parameter or
Ψ
JT
, has been defined to be (T
J
– T
T
)/ P
D
. This value gives a better
estimate of the junction temperature in natural convection when using the surface
temperature of the package. Remember that surface temperature readings of
packages are subject to significant errors caused by inadequate attachment of the
sensor to the surface and to errors caused by heat loss to the sensor. The
recommended technique is to attach a 40-gauge thermocouple wire and bead to the
top center of the package with thermally conductive epoxy.
F
Freescale Semiconductor, Inc.
n
.
相關(guān)PDF資料
PDF描述
DSP56721 SymphonyTM DSP56720 / DSP56721 Multi-Core Audio Processors
DSPA56720AG SymphonyTM DSP56720 / DSP56721 Multi-Core Audio Processors
DSPA56721AF SymphonyTM DSP56720 / DSP56721 Multi-Core Audio Processors
DSPA56721AG SymphonyTM DSP56720 / DSP56721 Multi-Core Audio Processors
DSPB56720AG SymphonyTM DSP56720 / DSP56721 Multi-Core Audio Processors
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DSP56004UM 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DSP56004 24-Bit Digital Signal Processor User＇s Manual Revision 1
DSP56004UM/AD 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:SYMPHONY AUDIO DSP FAMILY 24-BIT DIGITAL SIGNAL PROCESSORS
DSP56005DS 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DSP56005 24-Bit Digital Signal Processor Datasheet
DSP56005UM 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DSP56005 24-Bit Digital Signal Processor User＇s Manual
DSP56007DS 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DSP56007 24-Bit Digital Signal Processor Data Sheet
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*