參數(shù)資料
CY7C1380D
CY7C1382D
Document #: 38-05543 Rev. *D
Page 19 of 30
Capacitance
[19]
Parameter
C
IN
C
CLK
C
I/O
Description
Test Conditions
T
A
= 25°C, f = 1 MHz,
V
DD
= 3.3V.
V
DDQ
= 2.5V
100 TQFP
Package
5
5
5
119 BGA
Package
8
8
8
165 FBGA
Package
9
9
9
Unit
pF
pF
pF
Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
Thermal Resistance
[19]
Parameter
Θ
JA
Description
Test Conditions
Test conditions follow
standard test methods and
procedures for measuring
thermal impedance, per
EIA/JESD51.
100 TQFP
Package
28.66
119 BGA
Package
23.8
165 FBGA
Package
20.7
Unit
°C/W
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Θ
JC
4.08
6.2
4.0
°C/W
AC Test Loads and Waveforms
Notes:
19.Tested initially and after any design or process change that may affect these parameters.
OUTPUT
R = 317
R = 351
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Z
0
= 50
V
T
= 1.5V
3.3V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
1 ns
1 ns
(c)
OUTPUT
R = 1667
R = 1538
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Z
0
= 50
V
T
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
1 ns
1 ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load
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