參數(shù)資料
型號： CY7C1313BV18
廠商： Cypress Semiconductor Corp.
英文描述： 18-Mbit QDR-II SRAM 4-Word Burst Architecture(4字Burst結(jié)構(gòu),18-Mbit QDR-II SRAM)
中文描述： 18兆位QDR - II型SRAM的4字突發(fā)架構(gòu)（4字突發(fā)結(jié)構(gòu),18 - Mbit的QDR - II型的SRAM）
文件頁數(shù)： 27/28頁
文件大?。?/td> 459K
代理商： CY7C1313BV18
CY7C1311BV18
CY7C1911BV18
CY7C1313BV18
CY7C1315BV18
Document Number: 38-05620 Rev. *C
Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Page 27 of 28
QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress, Hitachi, IDT,NEC, and Samsung
technology. All product and company names mentioned in this document are the trademarks of their respective holders.
Package Diagram
A
PIN 1 CORNER
1
13.00±0.10
7
1.00
0.50 (0.25 M C A B
0.25 M0.05 M C
0.05 M C
B
A
0.15(4X)
0
SEATING PLANE
0
0
0
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
5
6
7
8
9
10
10.00
1
B
C
D
E
F
G
H
J
K
L
M
N
11
11
10
9
8
6
7
5
4
3
2
1
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
A
1
13.00±0.10
B
C
1
5.00
0
0.50 (165X)
1
SOLDNOTES :
PACKSOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKJEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AC
51-85180-*A
165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D
165-ball FBGA (13 x 15 x 1.4 mm) (51-85180)
A
1
PIN 1 CORNER
1
13.00±0.10
7
1.00
B
A
0.15(4X)
0
SEATING PLANE
0
0
0
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
2
3
4
5
6
7
8
9
10
10.00
1
B
C
D
E
F
G
H
J
K
L
M
N
11
11
10
9
8
6
7
5
4
3
2
1
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
A
1
13.00±0.10
B
C
1
5.00
0
PACKAGE WEIGHT : 0.475g
51-85180-*A
相關(guān)PDF資料
PDF描述
CY7C1315BV18 18-Mbit QDR-II SRAM 4-Word Burst Architecture(4字Burst結(jié)構(gòu),18-Mbit QDR-II SRAM)
CY7C1318AV18 18-Mbit DDR-II SRAM 2-Word Burst Architecture(18-Mb DDR-II SRAM（2-Word Burst結(jié)構(gòu)）)
CY7C1316AV18 18-Mbit DDR-II SRAM 2-Word Burst Architecture
CY7C1316AV18-167BZC 18-Mbit DDR-II SRAM 2-Word Burst Architecture
CY7C1318AV18-200BZC 18-Mbit DDR-II SRAM 2-Word Burst Architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1313BV18-167BZC 功能描述:靜態(tài)隨機(jī)存取存儲器 1Mx18 1.8V COM QDR II 靜態(tài)隨機(jī)存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1313BV18-167BZCT 功能描述:靜態(tài)隨機(jī)存取存儲器 1Mx18 1.8V COM QDR II 靜態(tài)隨機(jī)存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1313BV18-167BZXC 制造商:Cypress Semiconductor 功能描述:
CY7C1313BV18-200BZC 功能描述:靜態(tài)隨機(jī)存取存儲器 1Mx18 1.8V COM QDR II 靜態(tài)隨機(jī)存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1313BV18-250BZC 功能描述:靜態(tài)隨機(jī)存取存儲器 1Mx18 1.8V COM QDR II 靜態(tài)隨機(jī)存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
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