參數(shù)資料
型號: C3ENPA1-DS
英文描述: 5.0 or 3.3V, 256Kbit (32Kbit x 8) ZEROPOWER® SRAM
中文描述: ? - 3E的網(wǎng)絡(luò)處理器的數(shù)據(jù)資料硅修訂格A1
文件頁數(shù): 107/114頁
文件大小: 1893K
代理商: C3ENPA1-DS
Reflow
107
MOTOROLA GENERAL BUSINESS INFORMATION
C3ENPA1-DS/D REV 03
Reflow
Typical Reflow Profile for the C-3e Switch Module comprises:
1
Follow the guidelines recommended by your solder paste supplier.
Flux requirements must be met for best solderability.
2
The temperature profile should be carefully characterized to ensure uniform
temperature across the board and package.
Solder ball voiding may be affected by ramp rates and dwell times below and above
liquids.
3
A nitrogen atmosphere is not required, but will make the process more robust. It can
make a difference for marginally solderable PC board pads.
4
Full convection forced air furnaces work best, but IR, Convection/IR, or vapor phase can
be used.
F
n
.
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