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| 型號(hào)： | BCR3AS-12 |
| 英文描述： | Thyristor Product Catalog |
| 中文描述： | 晶閘管產(chǎn)品目錄 |
| 文件頁(yè)數(shù)： | 150/224頁(yè) |
| 文件大?。?/td> | 2697K |
| 代理商： | BCR3AS-12 |
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AN1005
Application Notes
http://www.teccor.com
+1 972-580-7777
AN1005 - 2
2002 Teccor Electronics
Thyristor Product Catalog
Reflow Soldering Zones
Zone 1: Initial Pre-heating Stage (25 °C to 150 °C)
Excess solvent is driven off.
PCB and Components are gradually heated up.
Temperature gradient shall be <2.5 °C/Sec.
Zone 2: Soak Stage (150 °C to 180 °C)
Flux components start activation and begin to reduce the
oxides on component leads and PCB pads.
PCB components are brought nearer to the temperature at
which solder bonding can occur.
Soak allows different mass components to reach the same
temperature.
Activated flux keeps metal surfaces from re-oxidizing.
Zone 3: Reflow Stage (180 °C to 235 °C)
Paste is brought to the alloy’s melting point.
Activated flux reduces surface tension at the metal interface so
metallurgical bonding occurs.
Zone 4: Cool-down Stage (180 °C to 25 °C)
Assembly is cooled evenly so thermal shock to the components
or PCB is reduced.
The surface tension of the liquid solder tends to draw the leads of
the device towards the center of the soldering area and so has a
correcting effect on slight mispositionings. However, if the layout
is not optimized, the same effect can result in undesirable shifts,
particularly if the soldering areas on the substrate and the com-
ponents are not concentrically arranged. This problem can be
solved by using a standard contact pattern which leaves suffi-
cient scope for the self-positioning effect (Figure AN1005.3 and
Figure AN1005.4) Figure AN1005.5 shows the reflow soldering
procedure.
Figure AN1005.3
Minimum Required Dimensions of Metal Connection
of Typical DO-214 Pads on Hybrid Thick- and Thin-
film Substrates
Figure AN1005.4
Modified DO-214 Compak — Three-leaded Surface
Mount Package
Figure AN1005.5
Reflow Soldering Procedure
After the solder is set and cooled, visually inspect the connec-
tions and, where necessary, correct with a soldering iron. Finally,
the remnants of the flux must be removed carefully.
Use vapor degrease with an azeotrope solvent or equivalent to
remove flux. Allow to dry.
After the drying procedure is complete, the assembly is ready for
testing and/or further processing.
0.079
(2.0)
0.110
(2.8)
0.079
(2.0)
Pad Outline
Dimensions are in inches (and millimeters).
0.079
(2.0)
0.040
(1.0)
0.030
(0.76)
0.079
(2.0)
0.079
(2.0)
0.110
(2.8)
Pad Outline
Dimensions are in inches (and millimeters).
1. Screen print solder paste
(or flux)
2. Place component
(allow flux to dry)
3. Reflow solder
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| BCR3AS-12A | 制造商:RENESAS 制造商全稱:Renesas Technology Corp 功能描述:Triac Low Power Use |
| BCR3AS-12A(A1#B02) | 制造商:Renesas Electronics 功能描述:Bulk 制造商:Renesas 功能描述:Thyristor TRIAC 600V 30A 3-Pin(2+Tab) MP-3 Tube |
| BCR3AS-12A-A1 | 制造商:RENESAS 制造商全稱:Renesas Technology Corp 功能描述:Triac Low Power Use |
| BCR3AS-12A-A1#B02 | 制造商:Renesas Electronics 功能描述:Tray |
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