參數(shù)資料
型號: AT91SAM9XE512-QU
廠商: Atmel
文件頁數(shù): 69/159頁
文件大?。?/td> 0K
描述: MCU ARM9 512K FLASH 208-PQFP
產(chǎn)品培訓模塊: MCU Product Line Introduction
標準包裝: 24
系列: SAM9XE
核心處理器: ARM9
芯體尺寸: 16/32-位
速度: 180MHz
連通性: EBI/EMI,以太網(wǎng),I²C,MMC,SPI,SSC,UART/USART,USB
外圍設(shè)備: 欠壓檢測/復位,POR,PWM,WDT
輸入/輸出數(shù): 96
程序存儲器容量: 512KB(512K x 8)
程序存儲器類型: 閃存
RAM 容量: 56K x 8
電壓 - 電源 (Vcc/Vdd): 1.65 V ~ 1.95 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 4x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 208-MQFP,208-PQFP
包裝: 托盤
配用: AT91SAM9XE-EK-ND - KIT EVAL FOR AT91SAM9XE
AT91SAM-ICE-ND - EMULATOR FOR AT91 ARM7/ARM9
PIC16F62X
DS40300C-page 158
Preliminary
2003 Microchip Technology Inc.
K04-007 18-Lead Plastic Dual In-line (P) – 300 mil
15
10
5
15
10
5
β
Mold Draft Angle Bottom
15
10
5
15
10
5
α
Mold Draft Angle Top
10.92
9.40
7.87
.430
.370
.310
eB
Overall Row Spacing
§
0.56
0.46
0.36
.022
.018
.014
B
Lower Lead Width
1.78
1.46
1.14
.070
.058
.045
B1
Upper Lead Width
0.38
0.29
0.20
.015
.012
.008
c
Lead Thickness
3.43
3.30
3.18
.135
.130
.125
L
Tip to Seating Plane
22.99
22.80
22.61
.905
.898
.890
D
Overall Length
6.60
6.35
6.10
.260
.250
.240
E1
Molded Package Width
8.26
7.94
7.62
.325
.313
.300
E
Shoulder to Shoulder Width
0.38
.015
A1
Base to Seating Plane
3.68
3.30
2.92
.145
.130
.115
A2
Molded Package Thickness
4.32
3.94
3.56
.170
.155
.140
A
Top to Seating Plane
2.54
.100
p
Pitch
18
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
1
2
D
n
E1
c
eB
β
E
α
p
A2
L
B1
B
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
§ Significant Characteristic
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