參數(shù)資料
型號: AT91SAM9XE512-QU
廠商: Atmel
文件頁數(shù): 34/159頁
文件大小: 0K
描述: MCU ARM9 512K FLASH 208-PQFP
產(chǎn)品培訓模塊: MCU Product Line Introduction
標準包裝: 24
系列: SAM9XE
核心處理器: ARM9
芯體尺寸: 16/32-位
速度: 180MHz
連通性: EBI/EMI,以太網(wǎng),I²C,MMC,SPI,SSC,UART/USART,USB
外圍設備: 欠壓檢測/復位,POR,PWM,WDT
輸入/輸出數(shù): 96
程序存儲器容量: 512KB(512K x 8)
程序存儲器類型: 閃存
RAM 容量: 56K x 8
電壓 - 電源 (Vcc/Vdd): 1.65 V ~ 1.95 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 4x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 208-MQFP,208-PQFP
包裝: 托盤
配用: AT91SAM9XE-EK-ND - KIT EVAL FOR AT91SAM9XE
AT91SAM-ICE-ND - EMULATOR FOR AT91 ARM7/ARM9
2003 Microchip Technology Inc.
Preliminary
DS40300C-page 127
PIC16F62X
17.0 ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Ambient temperature under bias................................................................................................................. -40 to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on V
DD with respect to VSS ............................................................................................................ -0.3 to +6.5V
Voltage on MCLR and RA4 with respect to V
SS ............................................................................................-0.3 to +14V
Voltage on all other pins with respect to V
SS ....................................................................................-0.3V to VDD + 0.3V
Total power dissipation(1) ..................................................................................................................................... 800 mW
Maximum current out of V
SS pin ...........................................................................................................................300 mA
Maximum current into V
DD pin ..............................................................................................................................250 mA
Input clamp current, I
IK (VI < 0 or VI > VDD)
..................................................................................................................... ± 20 mA
Output clamp current, IOK (Vo < 0 or Vo >V
DD)
............................................................................................................... ± 20 mA
Maximum output current sunk by any I/O pin.......................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .................................................................................................... 25 mA
Maximum current sunk by PORTA and PORTB.................................................................................................... 200 mA
Maximum current sourced by PORTA and PORTB .............................................................................................. 200 mA
Note 1: Power dissipation is calculated as follows: P
DIS = VDD x {IDD -
∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOl x IOL)
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note:
Voltage spikes below V
SS at the MCLR pin, inducing currents greater than 80 mA, may cause latchup. Thus,
a series resistor of 50-100
should be used when applying a “l(fā)ow” level to the MCLR pin rather than pulling
this pin directly to V
SS
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