
REV. B
ADV7330
–11–
ORDERING GUIDE
Model
Temperature Range
0
°
C to 70
°
C
Package Description
Package Option
ADV7330KST
Low Profile Quad Flat Package
ST-64-2
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADV7330 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS
1, 2
V
AA
to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +3.0 V
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +3.0 V
V
DD_IO
to GND_IO . . . . . . . . . . . . . . . . . . . . –0.3 V to +4.6 V
Digital Input Voltage to DGND . . . . –0.3 V to V
DD_IO
+ 0.3 V
V
AA
to V
DD
. . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
DGND to GND_IO . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
AGND to GND_IO . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Ambient Operating Temperature (T
A
) . . . . . . . . 0
°
C to 70
°
C
Storage Temperature (T
S
) . . . . . . . . . . . . . . –65
°
C to +150
°
C
Infrared Reflow Soldering (20 secs) . . . . . . . . . . . . . . . . 260
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational section
of this specification is not implied. Exposure to absolute maximum ratings for
extended periods may affect device reliability.
2
Analog output short circuit to any power supply or common can be of an indefinite
duration.
THERMAL CHARACTERISTICS
JC
= 11
°
C/W
JA
= 47
°
C/W
The ADV7330 is a Pb-free, environmentally friendly product. It is
manufactured using the most up-to-date materials and processes.
The coating on the leads of each device is 100% pure Sn electro-
plate. The device is suitable for Pb-free applications, and is able
to withstand surface-mount soldering at up to 255
°
C (
±
5
°
C).
In addition, it is backward compatible with conventional SnPb
soldering processes. This means that the electroplated Sn coating
can be soldered with Sn/Pb solder pastes at conventional reflow
temperatures of 220
°
C to 235
°
C.