參數(shù)資料
型號(hào): AD9522-3/PCBZ
廠商: Analog Devices Inc
文件頁(yè)數(shù): 57/84頁(yè)
文件大小: 0K
描述: BOARD EVAL FOR AD9522-3 CLK GEN
設(shè)計(jì)資源: AD9522 Eval Board Schematic
AD9522 BOM
標(biāo)準(zhǔn)包裝: 1
主要目的: 計(jì)時(shí),時(shí)鐘發(fā)生器
嵌入式:
已用 IC / 零件: AD9522-3
主要屬性: 12 LVDS/24 CMOS 輸出,2 GHz VCO
次要屬性: I²C & SPI 接口
已供物品:
AD9522-3
Rev. 0 | Page 60 of 84
THERMAL PERFORMANCE
Table 47. Thermal Parameters for the 64-Lead LFCSP
Symbol
Thermal Characteristic Using a JEDEC JESD51-7 Plus JEDEC JESD51-5 2S2P Test Board
Value (°C/W)
θJA
Junction-to-ambient thermal resistance, 0.0 m/sec airflow per JEDEC JESD51-2 (still air)
22.0
θJMA
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
19.2
θJMA
Junction-to-ambient thermal resistance, 2.0 m/sec airflow per JEDEC JESD51-6 (moving air)
17.2
ΨJB
Junction-to-board characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
11.6
θJC
Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1
1.3
ΨJT
Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)
0.1
The AD9522 is specified for a case temperature (TCASE). To ensure
that TCASE is not exceeded, an airflow source can be used.
Use the following equation to determine the junction
temperature on the application PCB:
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the user at the
top center of the package.
ΨJT is the value from Table 47.
PD is the power dissipation (see the total power dissipation in
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order
approximation of TJ by the equation
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of ΨJB are provided for package comparison and PCB
design considerations.
相關(guān)PDF資料
PDF描述
FCBP110LD1L03S KIT 3M LASERWIRE SFP+
VE-J4D-EZ-S CONVERTER MOD DC/DC 85V 25W
AD9520-2/PCBZ BOARD EVAL AD9520-2
AD9516-5/PCBZ BOARD EVAL FOR AD9516-5 2.5GHZ
FCBP110LD1L05 CABLE 10.5GBPS 5M LASERWIRE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AD9522-4 制造商:AD 制造商全稱:Analog Devices 功能描述:12 LVDS/24 CMOS Output Clock Generator with Integrated 1.6 GHz VCO
AD9522-4/PCBZ 功能描述:BOARD EVAL FOR AD9522-4 CLK GEN RoHS:是 類別:編程器,開(kāi)發(fā)系統(tǒng) >> 評(píng)估演示板和套件 系列:- 標(biāo)準(zhǔn)包裝:1 系列:PSoC® 主要目的:電源管理,熱管理 嵌入式:- 已用 IC / 零件:- 主要屬性:- 次要屬性:- 已供物品:板,CD,電源
AD9522-4BCPZ 功能描述:IC CLOCK GEN 1.6GHZ VCO 64LFCSP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器,PLL,頻率合成器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:Precision Edge® 類型:時(shí)鐘/頻率合成器 PLL:無(wú) 輸入:CML,PECL 輸出:CML 電路數(shù):1 比率 - 輸入:輸出:2:1 差分 - 輸入:輸出:是/是 頻率 - 最大:10.7GHz 除法器/乘法器:無(wú)/無(wú) 電源電壓:2.375 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VFQFN 裸露焊盤(pán),16-MLF? 供應(yīng)商設(shè)備封裝:16-MLF?(3x3) 包裝:帶卷 (TR) 其它名稱:SY58052UMGTRSY58052UMGTR-ND
AD9522-4BCPZ-REEL7 功能描述:IC CLOCK GEN 1.6GHZ VCO 64LFCSP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器,PLL,頻率合成器 系列:- 標(biāo)準(zhǔn)包裝:2,000 系列:- 類型:PLL 時(shí)鐘發(fā)生器 PLL:帶旁路 輸入:LVCMOS,LVPECL 輸出:LVCMOS 電路數(shù):1 比率 - 輸入:輸出:2:11 差分 - 輸入:輸出:是/無(wú) 頻率 - 最大:240MHz 除法器/乘法器:是/無(wú) 電源電壓:3.135 V ~ 3.465 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:32-LQFP 供應(yīng)商設(shè)備封裝:32-TQFP(7x7) 包裝:帶卷 (TR)
AD9522-5 制造商:AD 制造商全稱:Analog Devices 功能描述:12 LVDS/24 CMOS Output Clock Generator