
  A48P4616 
Preliminary (September, 2005, Version 0.0) 
1 
AMIC Technology, Corp.
Features 
CAS Latency and Frequency 
Maximum Operating Frequency (MHz) 
CAS 
Latency 
DDR400 (5T) 
DDR333 (6K) 
2 
- 
133 
2.5 
166 
166 
3 
200 
- 
 
DDR 256M bit, die C, based on 110nm design rules. 
 
Double data rate architecture: two data transfers per 
clock cycle. 
 
Bidirectional data strobe (DQ
S
) is transmitted and 
received with data, to be used in capturing data at the 
receiver. 
 
DQ
S
 is edge-aligned with data for reads and is center-
aligned with data for writes. 
 
Differential clock inputs (CK and CK) 
 
Four internal banks for concurrent operation. 
 
Data mask (DM) for write data. 
 
DLL aligns DQ and DQ
S
 transitions with CK transitions. 
 
Commands entered on each positive CK edge; data and 
data mask referenced to both edges of DQ
S
. 
 
Burst lengths: 2, 4, or 8 
 
CAS Latency: 2/2.5(DDR333), 2.5/3(DDR400) 
 
Auto Precharge option for each burst access 
 
Auto Refresh and Self Refresh Modes 
 
7.8μs Maximum Average Periodic Refresh Interval 
 
2.5V (SSTL_2 compatible) I/O 
 
V
DD
 = V
DDQ
 = 2.5V ± 0.2V (DDR333) 
 
V
DD
 = V
DDQ
 = 2.6V ± 0.1V (DDR400) 
 
Available in Halogen and Lead Free packaging 
General Description 
The 256Mb DDR SDRAM uses a double-data-rate architec-
ture to achieve high-speed operation. The double data rate 
architecture is essentially a 2n prefetch architecture with an 
interface designed to transfer two data words per clock cycle 
at the I/O pins. A single read or write access for the 256Mb 
DDR SDRAM effectively consists of a single 2n-bit wide, one 
clock cycle data transfer at the internal DRAM core and two 
corresponding n-bit wide, one-half-clock-cycle data transfers 
at the I/O pins. 
A bidirectional data strobe (DQ
S
) is transmitted externally, 
along with data, for use in data capture at the receiver. DQ
S
is a strobe transmitted by the DDR SDRAM during Reads 
and by the memory controller during Writes. DQ
S
 is edge-
aligned with data for Reads and center-aligned with data for 
Writes. 
The 256Mb DDR SDRAM operates from a differential clock 
(CK and CK; the crossing of CK going high and CK going 
LOW is referred to as the positive edge of CK). Commands 
(address and control signals) are registered at every positive 
edge of CK. Input data is registered on both edges of DQS, 
and output data is referenced to both edges of DQ
S
, as well 
as to both edges of CK. 
Read and write accesses to the DDR SDRAM are burst ori-
ented; accesses start at a selected location and continue for 
a programmed number of locations in a programmed 
sequence. Accesses begin with the registration of an Active 
command, which is then followed by a Read or Write com-
mand. The address bits registered coincident with the Active 
command are used to select the bank and row to be 
accessed. The address bits registered coincident with the 
Read or Write command are used to select the bank and the 
starting column location for the burst access. 
The DDR SDRAM provides for programmable Read or Write 
burst lengths of 2, 4, or 8 locations. An Auto Precharge func-
tion may be enabled to provide a self-timed row precharge 
that is initiated at the end of the burst access. 
As with standard SDRAMs, the pipelined, multibank architec-
ture of DDR SDRAMs allows for concurrent operation, 
thereby providing high effective bandwidth by hiding row pre-
charge and activation time. 
An auto refresh mode is provided along with a power-saving 
Power Down mode. All inputs are compatible with the 
JEDEC Standard for SSTL_2. All outputs are SSTL_2, Class 
II com-patible. 
The functionality described and the timing specifications 
included in this data sheet are for the DLL Enabled mode of 
operation.