![](http://datasheet.mmic.net.cn/340000/82595FX_datasheet_16452419/82595FX_35.png)
82595FX
11.0
ELECTRICAL SPECIFICATIONS
AND TIMINGS
11.1 Absolute Maximum Ratings
Case Temperature under Bias ààààààà0
§
C to
a
85
§
C
Storage Temperature àààààààààà
b
65
§
C to
a
140
§
C
All Output and Supply Voltages ààààà
b
0.5V to
a
7V
All Input Voltages ààààààààààààà
b
1.0V to
a
6.0V
(1)
Further information on the quality and reliability of
the 82595FX may be found in the Components
Quality and Reliability Handbook, Order Number
210997.
Table 11-1. DC Characteristics
(T
C
e
0
§
C to
a
85
§
C, V
CC
e
5V
g
5%)
Symbol
Parameter
V
IL
Input LOW Voltage (TTL)
V
IH
Input HIGH Voltage (TTL)
V
IH(JUMPR)
Input HIGH Voltage (Jumpers)
V
OL1(2)
Output LOW Voltage
V
OL2(3)
Output LOW Voltage
V
OL4(4)
Output LOW Voltage
V
OH
Output HIGH Voltage
V
OL
(LED)
(5)
Output Low Voltage
V
OH
(LED)
Output High Voltage
I
LP(6)
Leakage Current
R
DIFF(7)
Input Differential-Resistance
V
IDF
(TPE)
(8)
Input Differential Accept
Input Differential Reject
R
S
(TPE)
(9)
Output Source Resistance
V
IDF
(AUI)
(10)
Input Differential Accept
Input Differential Reject
V
ICM
(AUI)
(11)
AC Input Common Mode
NOTICE: This data sheet contains information on
products in the sampling and initial production phases
of development. The specifications are subject to
change without notice. Verify with your local Intel
Sales office that you have the latest data sheet be-
fore finalizing a design.
*
WARNING: Stressing the device beyond the ‘‘Absolute
Maximum Ratings’’ may cause permanent damage.
These are stress ratings only. Operation beyond the
‘‘Operating Conditions’’ is not recommended and ex-
tended exposure beyond the ‘‘Operating Conditions’’
may affect device reliability.
Min
b
0.3
2.0
3.0
Max
a
0.8
Units
V
V
V
V
V
V
V
V
V
m
A
K
X
V
P
V
P
X
V
P
V
P
V
P
V
P
V
mA
mV
mV
mA
m
A
mA
mA
pF
Test Conditions
V
CC
a
0.3
V
CC
a
0.3
0.45
0.45
0.45
I
OL
e
17 mA
I
OL
e
12 mA
I
OL
e
2 mA
I
OH
e b
1 mA
I
OL
e
10 mA
I
OH
e b
500
m
A
0
s
V
I
s
V
CC
DC
5 MHz
s
f
s
10 MHz
2.4
0.45
3.9
g
10
10
g
0.5
g
3.1
g
0.3
13
5
l
I
LOAD
l
e
25 mA
g
0.3
g
1.5
g
0.16
g
0.5
g
0.1
g
1.2
g
150
b
100
40
90
400
2
35
10
f
s
40 KHz
40 KHz
s
f
s
10 MHz
V
ODF
(AUI)
I
OSC
(AUI)
VU (AUI)
V
ODI
(AUI)
(12)
I
CC
I
CCHWPD
I
CCSWPD
I
CCSLEEP
C
IN(13)
Output Differential Voltage
AUI Output Short Circuit Current
Output Differential Undershoot
Differential Idle Voltage
Power Supply Current
Hardware Power Down
Software Power Down
Sleep Mode
Input Capacitance
g
0.45
Short Circuit to V
CC
or GND
@
f
e
1 MHz
NOTES:
1. The voltage level for RCV and CLSN pairs are
b
0.75V to
a
8.5V.
2. SDx, IOCS16.
3. IOCHRDY, IRQx.
4. LDATAx, LADDRx, LOE, LWE, BOOTCS, SRAMCS, EEPROMCS, SMOUT, TSTCLK, TDO, J1, J2.
5. LILED, ACTLED, POLED and TPEDBNCDAUI.
6. Pins: ACTLED, LILED, POLED, TPEDBNCDAUI.
7. RD to RD, RCV to RCV and CLSN to CLSN.
8. TPE input pins: RD and RD.
9. TPE output pins: TDH, TDH, TDL and TDL, R
S
measure V
CC
or V
SS
to pin.
10. AUI input pins: RCV and CLSN pairs.
11. AUI output pins: TPMT pair.
12. Measured 8.0
m
s after last positive transition of data packet.
13. Characterized, not tested.
35