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| 型號(hào)： | 80546KF |
| 廠商： | Intel Corp. |
| 英文描述： | 64-bit Intel Xeon Processor MP with up to 8MB L3 Cache |
| 中文描述： | 64位Intel Xeon處理器MP的高達(dá)8MB三級(jí)高速緩存 |
| 文件頁(yè)數(shù)： | 97/138頁(yè) |
| 文件大?。?/td> | 2666K |
| 代理商： | 80546KF |
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64-bit Intel
Xeon Processor MP with up to 8MB L3 Cache Datasheet
97
7
Thermal Specifications
7.1
Package Thermal Specifications
The 64-bit Intel
Xeon processor MP with up to 8MB L3 cache requires a thermal solution to
maintain temperatures within operating limits. Any attempt to operate the processor outside these
operating limits may result in permanent damage to the processor and potentially other components
within the system. As processor technology changes, thermal management becomes increasingly
crucial when building computer systems. Maintaining the proper thermal environment is key to
reliable, long-term system operation.
A complete solution includes both component and system level thermal management features.
Component level thermal solutions can include active or passive heatsinks attached to the
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of
system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to the Processor
Thermal/Mechanical Design Guidelines.
Note:
The boxed processor will ship with a component thermal solution. Refer to
Section 9
for details on
the boxed processor.
7.1.1
Thermal Specifications
To allow the optimal operation and long-term reliability of Intel processor-based systems, the
processor must remain within the minimum and maximum case temperature (T
CASE
) specifications
as defined by the applicable thermal profile (see
Table 7-1
and
Figure 7-1
). Thermal solutions not
designed to provide this level of thermal capability may affect the long-term reliability of the
processor and system.
The 64-bit Intel
Xeon processor MP with up to 8MB L3 cache introduces a new methodology
for managing processor temperatures which is intended to support acoustic noise reduction through
fan speed control and assure processor reliability. Selection of the appropriate fan speed will be
based on the temperature reported by the processor’s Thermal Diode. If the diode temperature is
greater than or equal to Tcontrol (see
Section 7.2.7
), then the processor case temperature must
remain at or below the temperature as specified by the thermal profile (see
Figure 7-1
). If the diode
temperature is less than Tcontrol, then the case temperature is permitted to exceed the thermal
profile, but the diode temperature must remain at or below Tcontrol. Systems that implement fan
speed control must be designed to take these conditions into account. Systems that do not alter the
fan speed only need to guarantee the case temperature meets the thermal profile specifications.
The processor thermal profile ensures adherence to Intel reliability requirements. The thermal
profile is representative of a volumetrically unconstrained thermal solution (i.e. industry enabled
2U+ heat sink). In this scenario, it is expected that the Thermal Control Circuit (TCC) would only
be activated for very brief periods of time when running the most power intensive applications.
The upper point of the thermal profile consists of the Thermal Design Power (TDP) defined in
Table 7-1
and the associated T
CASE
value. The lower point of the thermal profile consists of x =
P
CONTROL_BASE
and y = T
CASE_MAX
@ P
CONTROL_BASE
. Pcontrol is defined as the processor
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