參數(shù)資料
型號(hào): 80546KF
廠商: Intel Corp.
英文描述: 64-bit Intel Xeon Processor MP with up to 8MB L3 Cache
中文描述: 64位Intel Xeon處理器MP的高達(dá)8MB三級(jí)高速緩存
文件頁數(shù): 61/138頁
文件大?。?/td> 2666K
代理商: 80546KF
64-bit Intel
Xeon Processor MP with up to 8MB L3 Cache Datasheet
61
4
Mechanical Specifications
The 64-bit Intel
Xeon processor MP with up to 8MB L3 cache is packaged in a Flip-Chip
Micro Pin Grid Array 4 (FC-mPGA4) package that interfaces with the motherboard via a
mPGA604 socket. The package consists of a processor core mounted on a substrate pin-carrier. An
integrated heat spreader (IHS) is attached to the package substrate and core and serves as the
mating surface for processor component thermal solutions, such as a heatsink.
Figure 4-1
shows a
sketch of the processor package components and how they are assembled together.
The package components shown in
Figure 4-1
include the following:
1. Integrated Heat Spreader (IHS)
2. Processor die
3. FC-mPGA4 package
4. Pin-side capacitors
5. Package pin
Note:
This drawing is not to scale and is for reference only. The mPGA604 socket is not shown.
Figure 4-1. Processor Package Assembly Sketch
1
1
2
3
4
4
5
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3
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