參數(shù)資料
型號： 80546KF
廠商： Intel Corp.
英文描述： 64-bit Intel Xeon Processor MP with up to 8MB L3 Cache
中文描述： 64位Intel Xeon處理器MP的高達8MB三級高速緩存
文件頁數(shù)： 135/138頁
文件大?。?/td> 2666K
代理商： 80546KF
64-bit Intel
Xeon Processor MP with up to 8MB L3 Cache Datasheet
135
Boxed Processor Specifications
9.2.2
Boxed Processor Heatsink Weight
The boxed processor heatsink weight is approximately 530 grams. See
Section 4
of this document
for details on the processor weight.
9.2.3
Boxed Processor Retention Mechanism and Heatsink
Supports
Baseboards and chassis’s designed for use by system integrators should include holes that are in
proper alignment with each other to support the boxed processor. See
Figure 9-7
for example of
processor pitch and layout.
Figure 9-1
illustrates the new retention solution. This is designed to extend air-cooling capability
through the use of larger heatsinks with minimal airflow blockage and minimal bypass. These
retention mechanisms can allow the use of much heavier heatsink masses compared to legacy
solution limitations by using a load path attached to the chassis pan. The cooling solution spring
(
Figure 9-1
labeled as “CEK SPRING”) on the under side of the baseboard provides the necessary
compressive load for the thermal interface material. The baseboard is intended to be isolated such
that the dynamic loads from the heatsink are transferred to the chassis pan via the heatsink screws
and heatsink standoffs. This reduces the risk of package pullout and solder joint failures in a shock
and vibe situation.
The assembly requires larger diameter holes to compensate for the cooling solution spring
embosses. See
Figure 9-2
and
Figure 9-3
for processor mounting through holes.
9.3
Thermal Specifications
This section describes the cooling requirements of the heatsink solution utilized by the boxed
processor.
9.3.1
Boxed Processor Cooling Requirements
The boxed processor will be cooled by forcing ducted chassis fan airflow through the passive heat
sink solution. Meeting the processor’s temperature specifications is a function of the thermal
design of the entire system, and ultimately the responsibility of the system integrator. The
processor temperature specification is found in
Section 7
of this document. For the boxed
processor passive heatsink to operate properly, chassis air movement devices are required.
Necessary airflow and associated flow impedance is 29 cfm at 0.10” H
2
O.
In addition, the processor pitch should be 3.25 inches, or slightly more, when placed in side by side
orientation.
Figure 9-7
illustrates the side by side orientation and pitch. Note that the heatsinks are
interleaved to reduce air bypass.
It is also recommended that the ambient air temperature outside of the chassis be kept at or below
35
°
C. The air passing directly over the processor heatsink should not be preheated by other system
components (such as another processor), and should be kept at or below 40
°
C. Again, meeting the
processor’s temperature specification is the responsibility of the system integrator.
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