參數(shù)資料
型號: XCV800
廠商: Xilinx, Inc.
英文描述: Virtex 2.5 V Field Programmable Gate Arrays(Virtex 2.5V現(xiàn)場可編程門陣列)
中文描述: 2.5伏的Virtex現(xiàn)場可編程門陣列(的Virtex 2.5V的現(xiàn)場可編程門陣列)
文件頁數(shù): 6/72頁
文件大?。?/td> 456K
代理商: XCV800
Virtex
2.5 V Field Programmable Gate Arrays
6
DS003 (v2.4) October 6, 2000 - Final Product Specification
R
Additional Logic
The F5 multiplexer in each slice combines the function gen-
erator outputs. This combination provides either a function
generator that can implement any 5-input function, a 4:1
multiplexer, or selected functions of up to nine inputs.
Similarly, the F6 multiplexer combines the outputs of all
four function generators in the CLB by selecting one of the
F5-multiplexer outputs. This permits the implementation of
any 6-input function, an 8:1 multiplexer, or selected func-
tions of up to 19 inputs.
Each CLB has four direct feedthrough paths, one per LC.
These paths provide extra data input lines or additional
local routing that does not consume logic resources.
Arithmetic Logic
Dedicated carry logic provides fast arithmetic carry capabil-
ity for high-speed arithmetic functions. The Virtex CLB sup-
ports two separate carry chains, one per Slice. The height
of the carry chains is two bits per CLB.
The arithmetic logic includes an XOR gate that allows a
1-bit full adder to be implemented within an LC. In addition,
a dedicated AND gate improves the efficiency of multiplier
implementation.
The dedicated carry path can also be used to cascade
function generators for implementing wide logic functions.
BUFTs
Each Virtex CLB contains two 3-state drivers (BUFTs) that
can drive on-chip busses.
See
Dedicated Routing
on
page 9.
Each Virtex BUFT has an independent 3-state con-
trol pin and an independent input pin.
Block SelectRAM
Virtex FPGAs incorporate several large Block SelectRAM
memories. These complement the distributed LUT Selec-
tRAMs that provide shallow RAM structures implemented
in CLBs.
Block SelectRAM memory blocks are organized in col-
umns. All Virtex devices contain two such columns, one
along each vertical edge. These columns extend the full
height of the chip. Each memory block is four CLBs high,
and consequently, a Virtex device 64 CLBs high contains
16 memory blocks per column, and a total of 32 blocks.
F1
F2
F3
F4
G1
G2
G3
G4
Carry &
Control
Carry &
Control
Carry &
Control
Carry &
Control
LUT
CIN
CIN
COUT
COUT
YQ
XQ
XQ
YQ
X
XB
Y
YB
YB
Y
BX
BY
BX
BY
G1
G2
G3
G4
F1
F2
F3
F4
slice_b.eps
Slice 1
Slice 0
XB
X
LUT
LUT
LUT
D
EC
Q
RC
SP
D
EC
Q
RC
SP
D
EC
Q
RC
SP
D
EC
Q
RC
SP
Figure 4: 2-Slice Virtex CLB
相關(guān)PDF資料
PDF描述
XCV812E-6BG404C Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays
XCV812E-6BG404I Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays
XCV812E-6BG556C Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XCV800-4BG432C 功能描述:IC FPGA 2.5V C-TEMP 432-MBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Virtex® 標準包裝:1 系列:Kintex-7 LAB/CLB數(shù):25475 邏輯元件/單元數(shù):326080 RAM 位總計:16404480 輸入/輸出數(shù):350 門數(shù):- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:900-FCBGA(31x31) 其它名稱:122-1789
XCV800-4BG432I 功能描述:IC FPGA 2.5V I-TEMP 432-MBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Virtex® 標準包裝:1 系列:Kintex-7 LAB/CLB數(shù):25475 邏輯元件/單元數(shù):326080 RAM 位總計:16404480 輸入/輸出數(shù):350 門數(shù):- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:900-FCBGA(31x31) 其它名稱:122-1789
XCV800-4BG560C 功能描述:IC FPGA 2.5V C-TEMP 560-MBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Virtex® 標準包裝:1 系列:Kintex-7 LAB/CLB數(shù):25475 邏輯元件/單元數(shù):326080 RAM 位總計:16404480 輸入/輸出數(shù):350 門數(shù):- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:900-FCBGA(31x31) 其它名稱:122-1789
XCV800-4BG560I 功能描述:IC FPGA 2.5V I-TEMP 560-MBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Virtex® 標準包裝:1 系列:Kintex-7 LAB/CLB數(shù):25475 邏輯元件/單元數(shù):326080 RAM 位總計:16404480 輸入/輸出數(shù):350 門數(shù):- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:900-FCBGA(31x31) 其它名稱:122-1789
XCV8004FG676C 制造商:XILINX 功能描述:*