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參數(shù)資料
| 型號： | XC7445B |
| 廠商： | 飛思卡爾半導體(中國)有限公司 |
| 英文描述： | RISC Microprocessor Hardware Specifications |
| 中文描述： | RISC微處理器硬件規(guī)格 |
| 文件頁數(shù)： | 57/64頁 |
| 文件大?。?/td> | 1127K |
| 代理商： | XC7445B |
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MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1
Freescale Semiconductor
57
System Design Information
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
800-248-2481
888-642-7674
888-246-9050
The following section provides a heat sink selection example using one of the commercially available heat sinks.
9.8.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
T
j
= T
a
+ T
r
+ (R
θ
JC
+ R
θ
int
+ R
θ
sa
)
×
P
d
where:
T
j
is the die-junction temperature
T
a
is the inlet cabinet ambient temperature
T
r
is the air temperature rise within the computer cabinet
R
θ
JC
is the junction-to-case thermal resistance
R
θ
int
is the adhesive or interface material thermal resistance
R
θ
sa
is the heat sink base-to-ambient thermal resistance
P
d
is the power dissipated by the device
During operation, the die-junction temperatures (T
j
) should be maintained less than the value specified in
Table 4
.
The temperature of air cooling the component greatly depends on the ambient inlet air temperature and the air
temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (T
a
) may range from 30°
to 40°C. The air temperature rise within a cabinet (T
r
) may be in the range of 5° to 10°C. The thermal resistance of
the thermal interface material (R
θ
int
) is typically about 1.5°C/W. For example, assuming a T
a
of 30°C, a T
r
of 5°C,
a CBGA package R
θ
JC
= 0.1, and a typical power consumption (P
d
) of 15.0 W, the following expression for T
j
is
obtained:
Die-junction temperature:
T
j
= 30°C + 5°C + (0.1°C/W + 1.5°C/W + R
θ
sa
)
×
15 W
For this example, a R
θ
sa
value of 3.1°C/W or less is required to maintain the die-junction temperature below the
maximum value of
Table 4
.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure-of-merit
used for comparing the thermal performance of various microelectronic packaging technologies, one should
exercise caution when only using this metric in determining thermal management because no single parameter can
adequately describe three-dimensional heat flow. The final die-junction operating temperature is not only a function
of the component-level thermal resistance, but the system-level design and its operating conditions. In addition to
the component's power consumption, a number of factors affect the final operating die-junction
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