參數(shù)資料
型號: XC7445B
廠商: 飛思卡爾半導體(中國)有限公司
英文描述: RISC Microprocessor Hardware Specifications
中文描述: RISC微處理器硬件規(guī)格
文件頁數(shù): 43/64頁
文件大?。?/td> 1127K
代理商: XC7445B
MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1
Freescale Semiconductor
43
Package Description
8.3 Substrate Capacitors for the MPC7445, 360 CBGA
Figure 21
shows the connectivity of the substrate capacitor pads for the MPC7445, 360 CBGA. All capacitors are
100 nF.
Figure 21. Substrate Bypass Capacitors for the MPC7445, 360 CBGA
8.4 Package Parameters for the MPC7455, 483 CBGA
The package parameters are as provided in the following list. The package type is 29
×
29 mm, 483-lead ceramic
ball grid array (CBGA).
Package outline
29
×
29 mm
Interconnects
483 (22
×
22 ball array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height
Maximum module height
3.22 mm
Ball diameter
0.89 mm (35 mil)
Capacitor
Pad Number
-1
-2
C1
OV
DD
V
DD
OV
DD
V
DD
OV
DD
V
DD
GND
C2
GND
C3
GND
C4
GND
C5
GND
C6
GND
1
C3-1
C3-2
C2-2
C1-2
C1-1
C2-1
A1 Corner
C4-1
C4-2
C5-2
C6-2
C6-1
C5-1
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