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參數(shù)資料
| 型號： | UPD78011HGK-XXX-8A8 |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PQFP64 |
| 封裝： | 12 X 12 MM, PLASTIC, LQFP-64 |
| 文件頁數(shù)： | 60/70頁 |
| 文件大?。?/td> | 540K |
| 代理商： | UPD78011HGK-XXX-8A8 |
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61
PD78011H, 78012H, 78013H, 78014H
Table 14-1. Surface Mounting Type Soldering Conditions (2/2)
(2)
PD78011HGK-×××-8A8: 64-Pin Plastic LQFP (12 × 12 mm)
PD78012HGK-×××-8A8: 64-Pin Plastic LQFP (12 × 12 mm)
PD78013HGK-×××-8A8: 64-Pin Plastic LQFP (12 × 12 mm)
PD78014HGK-×××-8A8: 64-Pin Plastic LQFP (12 × 12 mm)
Recommended
Condition Symbol
Soldering Method
Soldering Conditions
Infrared reflow
VPS
Wave soldering
Partial heating
Package peak temperature: 235
°C, Duration: 30 sec. max. (at 210 °C or above),
Number of times: Twice max., Number of days: 7 days Note (after that, 125
°C prebaking
for 10 hours is necessary.)
< Points to note >
Products packed in packing materials other than heat-resistant trays (such as maga-
zines, taping, and non-heat resistance tray) cannot be baked while packed.
Package peak temperature: 215
°C, Duration: 40 sec. max. (at 200 °C or above),
Number of times: Twice max., Number of days: 7 days Note (after that, 125
°C prebaking
for 10 hours is necessary.)
< Points to note >
Products packed in packing materials other than heat-resistant trays (such as maga-
zines, taping, and non-heat resistance tray) cannot be baked while packed.
Solder bath temperature: 260
°C max. Duration: 10 sec. max.
Number of times: Once, Preliminary heat temperature: 120
°C max. (Package surface
temperature), Number of days: 7 days Note (after that, 125
°C prebaking for 10 hours is
necessary.)
Pin temperature: 300
°C max., Duration: 3 sec. max. (per device side)
IR35-107-2
VP15-107-2
WS60-107-1
—
Note The number of days the device can be stored at 25
°C, 65% RH MAX. after the dry pack has been opend.
Caution Use more than one soldering method should be avoided (except in the case of partial heating).
Table 14-2. Insertion Type Soldering Conditions
PD78011HCW-××× : 64-Pin Plastic Shrink DIP (750 mil)
PD78012HCW-××× : 64-Pin Plastic Shrink DIP (750 mil)
PD78013HCW-××× : 64-Pin Plastic Shrink DIP (750 mil)
PD78014HCW-××× : 64-Pin Plastic Shrink DIP (750 mil)
Soldering Method
Soldering Conditions
Wave soldering
(pin only)
Partial heating
Solder bath temperature: 260
°C max., Duration: 10 sec. max.
Pin temperature: 300
°C max., Duration: 3 sec. max. (per pin)
Caution
Wave soldering is only for the lead part in order that jet solder can not contact with the chip directly.
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