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參數(shù)資料
| 型號(hào)： | UPD78011HGK-XXX-8A8 |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PQFP64 |
| 封裝： | 12 X 12 MM, PLASTIC, LQFP-64 |
| 文件頁(yè)數(shù)： | 59/70頁(yè) |
| 文件大?。?/td> | 540K |
| 代理商： | UPD78011HGK-XXX-8A8 |
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PD78011H, 78012H, 78013H, 78014H
13. RECOMMENDED SOLDERING CONDITIONS
The
PD78011F/78012F/78013F/78014F/78015F/78016F should be soldered and mounted under the conditions
recommended in the table below.
For detail of recommended soldering conditions, refer to the information document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact our salespersonnel.
Table 14-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
PD78011HGC-×××-AB8 : 64-Pin Plastic QFP (14 × 14 mm)
PD78012HGC-×××-AB8 : 64-Pin Plastic QFP (14 × 14 mm)
PD78013HGC-×××-AB8 : 64-Pin Plastic QFP (14 × 14 mm)
PD78014HGC-×××-AB8 : 64-Pin Plastic QFP (14 × 14 mm)
Recommended
Condition Symbol
Soldering Method
Soldering Conditions
Infrared reflow
VPS
Wave soldering
Partial heating
Package peak temperature: 235
°C, Duration: 30 sec. max. (at 210 °C or above),
Number of times: Thrice max.
Package peak temperature: 215
°C, Duration: 40 sec. max. (at 200 °C or above),
Number of times: Thrice max.
Solder bath temperature: 260
°C max. Duration: 10 sec. max.
Number of times: Once
Preliminary heat temperature: 120
°C max. (Package surface temperature)
Pin temperature: 300
°C max., Duration: 3 sec. max. (per device side)
IR35-00-3
VP15-00-3
WS60-00-1
—
Caution Use more than one soldering method should be avoided (except in the case of partial heating).
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