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參數(shù)資料
| 型號： | UPD7554AGA |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機(jī) |
| 文件頁數(shù)： | 57/64頁 |
| 文件大?。?/td> | 991K |
| 代理商： | UPD7554AGA |
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57
μ
PD7554A, 7554A(A)
11. RECOMMENDED SOLDERING CONDITIONS
Solder
μ
PD7554A on the following recommended conditions.
For details of recommended soldering conditions, refer to the information document
“Semiconductor device
mounting technology manual” (IEI-1207).
For details on the soldering method and soldering conditions other than the recommended conditions, call the
NEC salesman.
Table 11-1 Surface Mounting Type Soldering Conditions
μ
PD7554AG-
×××
μ
PD7554AG(A)-
×××
: 20-pin plastic SOP (300 mil)
: 20-pin plastic SOP (300 mil)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
IR30-00-1
VPS
VP15-00-1
Wave soldering
WS60-00-1
Pin part heating
Pin temperature: 300
°
C or below, Duration: 3 sec. max. (per device side)
––
Caution Use of more than one soldering method should be avoided (except in the case of pin part heating).
Table 11-2 Insertion Type Soldering Conditions
μ
PD7554ACS-
×××
μ
PD7554ACS(A)-
×××
: 20-pin plastic shrink DIP (300 mil)
: 20-pin plastic shrink DIP (300 mil)
Soldering Method
Soldering Conditions
Wave soldering
(pin only)
Solder bath temperatures: 260
°
C or below, Duration: 10 sec. max.
Pin part heating
Pin temperature: 300
°
C or below, Duration: 3 sec. max. (Per pin)
Caution
Ensure that the application of wave soldering is limited to the pins and no solder touches the main unit
directly.
#
Package peak temperature: 230
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Once
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: Once
Solder bath temperature: 260
°
C or below, Duration: 10 sec. max.,
Number of times: once, Preparatory heating tempererature: 120
°
C max.
(Package surface temperature)
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