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參數(shù)資料
| 型號： | UPD75048GC |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機(jī) |
| 文件頁數(shù)： | 63/68頁 |
| 文件大?。?/td> | 538K |
| 代理商： | UPD75048GC |
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63
μ
PD75048
14. RECOMMENDED SOLDERING CONDITIONS
It is recommended that
μ
PD75048 be soldered under the following conditions. For details on the
recommended soldering conditions, refer to Information Document "Semiconductor Devices Mounting
Manual" (IEI-616). For other soldering methods and conditions, consult NEC.
Table 14-1 Soldering Conditions of Surface Mount Type
μ
PD75048GC - xxx - AB8: 64-pin plastic QFP ( 14 mm)
Soldering Method
Soldering Conditions
Symbol for Recommended
Condition
Ware Soldering
Soldering bath temperature: 260
°
C max.,
time: 10 seconds max., number of times: 1,
maximum number of days: 2 days*,
(beyond this period, 16 hours of pre-baking is required
at 125
°
C), Pre-heating temperature: 120
°
C max.
Package peak temperature: 230
°
C,
time: 30 seconds max. (210
°
C min.),
number of times: 1, maximum number of days: 2 days*
(beyond this period, 16 hours of pre-baking is required
at 125
°
C)
Package peak temperature: 215
°
C,
time: 40 seconds max. (200
°
C min.),
number of times: 1, maximum number of days: 2 days*
(beyond this period, 16 hours of pre-baking is required
at 125
°
C)
Pin temperature: 300
°
C max.,
time: 3 seconds max. (per side)
WS60-162-1
Infrared Reflow
IR30-162-1
VPS
VP15-162-1
Pin Partial Heating
—
*:
Number of days after unpacking the dry pack. Storage conditions are 25
°
C and 65%RH max.
Note:
Do not use two or more soldering methods in combination (except the pin partial heating
method).
Table 14-2 Soldering Conditions of Through-Hole Type
μ
PD75048CW - xxx: 64-pin plastic shrink DIP (750 mil)
Soldering Method
Soldering Conditions
Wave soldering
(lead parts only)
Pin Partial Heating
Soldering bath temperature: 260
°
C max.,
time: 10 seconds max.,
Pin temperature: 260
o
C max.,
time: 10 seconds max.
Caution:
The wave soldering must be performed at the lead part only. Note that the
soldering must not be directly contacted to the board.
A model that can be soldered under the more stringent conditions (infrared reflow peak temperature:
235
°
C, numbver of times:2, and an extended number of days) is also available.
For details, consult NEC.
Notice
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