
User’s Manual  U15862EJ3V0UD
18
22.1
22.2
22.3
Overview ................................................................................................................................... 671
Configuration............................................................................................................................ 671
Operation .................................................................................................................................. 672
CHAPTER  23   REGULATOR ..................................................................................................................675
23.1
Overview ................................................................................................................................... 675
23.2
Operation .................................................................................................................................. 675
CHAPTER  24   ROM  CORRECTION  FUNCTION..................................................................................677
24.1
Overview ................................................................................................................................... 677
24.2
Control Registers..................................................................................................................... 678
24.2.1
Correction address registers 0 to 3 (CORAD0 to CORAD3)........................................................ 678
24.2.2
Correction control register (CORCN)........................................................................................... 679
24.3
ROM Correction Operation and Program Flow..................................................................... 679
CHAPTER  25   FLASH  MEMORY...........................................................................................................681
25.1
Features .................................................................................................................................... 681
25.2
Writing with Flash Programmer.............................................................................................. 682
25.3
Programming Environment..................................................................................................... 688
25.4
Communication Mode.............................................................................................................. 688
25.5
Pin Processing ......................................................................................................................... 691
25.5.1
V
PP
 pin ......................................................................................................................................... 691
25.5.2
Serial interface pins..................................................................................................................... 692
25.5.3
RESET pin................................................................................................................................... 694
25.5.4
Port pins ...................................................................................................................................... 694
25.5.5
Other signal pins.......................................................................................................................... 694
25.5.6
Power supply............................................................................................................................... 694
25.6
Programming Method.............................................................................................................. 695
25.6.1
Controlling flash memory............................................................................................................. 695
25.6.2
Flash memory programming mode.............................................................................................. 696
25.6.3
Selecting communication mode................................................................................................... 696
25.6.4
Communication commands ......................................................................................................... 697
25.6.5
Resources used........................................................................................................................... 698
CHAPTER  26   ELECTRICAL  SPECIFICATIONS..................................................................................699
CHAPTER  27   PACKAGE  DRAWINGS.................................................................................................741
CHAPTER  28   RECOMMENDED  SOLDERING  CONDITIONS............................................................745
APPENDIX  A   REGISTER  INDEX..........................................................................................................748
APPENDIX  B   REVISION  HISTORY ......................................................................................................755