參數(shù)資料
型號(hào): TPS40180RGER
廠商: TEXAS INSTRUMENTS INC
元件分類: 穩(wěn)壓器
英文描述: 0.05 A SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PQCC24
封裝: GREEN, PLASTIC, VQFN-24
文件頁數(shù): 28/52頁
文件大?。?/td> 1291K
代理商: TPS40180RGER
www.ti.com
GSNS
VSNS
I LI M
AGND
VI N
BP5
AGND
PVCC
PGND
LDRV
PVCC
SW
HDRV
SW
PVCC
CLKI O
BP5
PGOOD
PSEL
CS+
VOUT
PGND
PowerPad Layout
SLVS753B – FEBRUARY 2007 – REVISED NOVEMBER 2007
Figure 35. TPS40180 Recommended Layout for Peripheral Components
The PowerPAD package provides low thermal impedance for heat removal from the device. The PowerPAD
derives its name and low thermal impedance from the large bonding pad on the bottom of the device. The circuit
board must have an area of solder-tinned-copper underneath the package. The dimensions of this area depend
on the size of the PowerPAD package. Thermal vias connect this area to internal or external copper planes
and should have a drill diameter sufficiently small so that the via hole is effectively plugged when the barrel of the
via is plated with copper. This plug is needed to prevent wicking the solder away from the interface between the
package body and the solder-tinned area under the device during solder reflow. Drill diameters of 0.33 mm (13
mils) works well when 1-oz copper is plated at the surface of the board while simultaneously plating the barrel of
the via. If the thermal vias are not plugged when the copper plating is performed, then a solder mask material
should be used to cap the vias with a diameter equal to the via diameter plus 0.1 mm minimum. This capping
prevents the solder from being wicked through the thermal vias and potentially creating a solder void under the
package. Refer to PowerPAD Thermally Enhanced Package for more information on the PowerPAD
package
34
Copyright 2007, Texas Instruments Incorporated
Product Folder Link(s): TPS40180
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