參數(shù)資料
型號(hào): TDA8757CHV/21
廠商: NXP SEMICONDUCTORS
元件分類(lèi): ADC
英文描述: 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
封裝: 20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, SOT-612-1, HLQFP-144
文件頁(yè)數(shù): 32/38頁(yè)
文件大小: 894K
代理商: TDA8757CHV/21
Koninklijke Philips Electronics N.V. 2002.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 14 August 2002
Document order number: 9397 750 10111
Contents
Philips Semiconductors
TDA8757C
Triple 8-bit ADC 205 Msps
9I2C-bus and 3W-bus interfaces . . . . . . . . . . . . 17
I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 22
15
Handling information. . . . . . . . . . . . . . . . . . . . 34
16
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
16.1
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
16.2
Reow soldering . . . . . . . . . . . . . . . . . . . . . . . 34
16.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 34
16.4
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 35
16.5
Package related soldering information . . . . . . 35
18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 37
19
Denitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
20
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
21
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
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