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18.2 ABSOLUTE MAXIMUM RATINGS
Stresses above those listed as “absolute maxi-
mum ratings” may cause permanent damage to
the Device. This is a stress rating only and func-
tional operation of the Device under these condi-
tions is not implied. Exposure to maximum rating
conditions for extended periods may affect device
reliability.
18.2.1 Voltage Characteristics
18.2.2 Current Characteristics
18.2.3 Thermal Characteristics
Notes:
1. Directly connecting the RESET and I/O pins to VDD33 or VSS could damage the Device if an unintentional internal reset
is generated or an unexpected change of the I/O configuration occurs (for example, due to a corrupted program counter).
To guarantee safe operation, this connection has to be done through a pull-up or pull-down resistor (typical: 4.7k
for
RESET, 10k
for I/Os). For the same reason, unused I/O pins must not be directly tied to V
DD33 or VSS.
2. When the current limitation is not possible, the VIN absolute maximum rating must be respected, otherwise refer to
IINJ(PIN) specification. A positive injection is induced by VIN>VDD33 while a negative injection is induced by VIN<VSS.
3. All power supply (VDD33) and ground (VSS) lines must always be connected to the external supply.
4. Refer to table 6, to know the output drive capability of each I/Os
Symbol
Ratings
Maximum value
Unit
VDD33 - VSS
Supply voltage
4.0
V
VIN
1) & 2)
Input voltage on any other pin
VSS-0.3 to VDD33+0.3
V
VESD(HBM)
Electro-static discharge voltage (Human Body Model)
VESD(MM)
Electro-static discharge voltage (Machine Model)
Symbol
Ratings
Maximum value
Unit
IVDD33
Total current into VDD33 power lines (source)
3)
200
mA
IVSS
Total current out of VSS ground lines (sink)
3)
200
IIO
(4)
Output current sunk by any I/O D2 type
25
Output current sunk by any I/O D4 type
35
Output current sunk by any I/O D8 type
50
Output current source by any I/Os and control pin
-25
Symbol
Ratings
Value
Unit
TSTG
Storage temperature range
-65 to +150
°C
TJMAX
Maximum junction temperature 7)
120
°C