參數(shù)資料
型號： SM65MLVD205AD
廠商： Texas Instruments, Inc.
英文描述： MULTIPOINT-LVDS LINE DRIVER AND RECEIVER
中文描述： 多點(diǎn)LVDS線路驅(qū)動器和接收器
文件頁數(shù)： 19/26頁
文件大小： 517K
代理商： SM65MLVD205AD
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOIC
Package
Drawing
D
Pins Package
Qty
75
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN65MLVD200AD
ACTIVE
8
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
50
Green (RoHS &
no Sb/Br)
50
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
75
Green (RoHS &
no Sb/Br)
75
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
50
Green (RoHS &
no Sb/Br)
50
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD200ADG4
ACTIVE
SOIC
D
8
75
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD200ADR
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD200ADRG4
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD202AD
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD202ADG4
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD202ADR
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD202ADRG4
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD204AD
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD204ADG4
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD204ADR
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD204ADRG4
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD205AD
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD205ADG4
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD205ADR
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD205ADRG4
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com
8-Jan-2007
Addendum-Page 1
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