參數(shù)資料
型號： SC16IS741IPW
廠商： NXP SEMICONDUCTORS
元件分類： 微控制器/微處理器
英文描述： Single UART with I2C-bus-SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support
中文描述： 1 CHANNEL(S), 5M bps, I2C BUS CONTROLLER, PDSO16
封裝： 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
文件頁數(shù)： 48/52頁
文件大?。?/td> 382K
代理商： SC16IS741IPW
SC16IS741_1
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 29 April 2010
48 of 52
NXP Semiconductors
SC16IS741
Single UART with I
2
C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 34
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 36
and
37
Table 36.
Package thickness (mm)
Table 37.
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 34
.
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC16IS741IPW,112 功能描述:UART 接口集成電路 IC UART RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16IS741IPW,118 功能描述:UART 接口集成電路 SINGLE UART W/ 12C-BUS/SPI INTERFC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16IS741IPW,128 功能描述:UART 接口集成電路 IC UART RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16IS74Q900 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Single UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs
SC16IS750 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Single UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support
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