參數(shù)資料
型號(hào)： S71AL016D02-B7
廠商： Spansion Inc.
英文描述： Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述： 堆疊式多芯片產(chǎn)品（MCP）的閃存和RAM
文件頁(yè)數(shù)： 60/76頁(yè)
文件大?。?/td> 909K
代理商： S71AL016D02-B7
60
2Mbit Type 1 SRAM
SRAM_Type01_03A0 August 4, 2004
P r e l i m i n a r y
Functional Description
Notes:
1. When UB# and LB# are in select mode (low), I/O0 - I/O15 are affected as shown. When only LB# is in the select mode, only
I/O0 - I/O7 are affected as shown. When UB# is in the select mode only I/O8 - I/O15 are affected as shown.
2. When the device is in standby mode, control inputs (WE#, OE#, UB#, and LB#), address inputs and data input/outputs are
internally isolated from any external influence and disabled from exerting any influence externally.
3. When WE# is invoked, the OE# input is internally disabled and has no effect on the circuit.
Capacitance
Note:
These parameters are verified in device characterization and are not 100% tested.
Absolute Maximum Ratings
Note:
Stresses greater than those listed above may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions above those indicated in the operating section of
this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reli-
ability.
CE#
CE2
WE#
OE#
UB#
LB#
IO
0~15
(Note 1)
Mode
Power
H
X
X
X
X
X
High-Z
Standby (Note 2)
Standby
X
L
X
X
X
X
High-Z
Standby (Note 2)
Standby
L
H
X
X
H
H
High-Z
Standby
Standby
L
H
L
X (Note 3)
L (Note 1)
L (Note 1)
Data In
Write (Note 3)
Active
L
H
H
L
L (Note 1)
L (Note 1)
Data Out
Read
Active
L
H
H
H
L (Note 1)
L (Note 1)
High-Z
Active
Active
Item
Symbol
Test Condition
Min
Max
Unit
Input Capacitance
C
IN
V
IN
= 0V, f = 1 MHz, T
A
= 25°C
8
pF
I/O Capacitance
C
I/O
V
IN
= 0V, f = 1 MHz, T
A
= 25°C
8
pF
Item
Symbol
Ratings
Unit
Voltage on any pin relative to V
SS
V
IN
,V
OUT
–0.3 to V
CC
+ 0.3
V
Voltage on V
CC
supply relative to V
SS
V
CC
-0.3 to 4.5V
V
Power Dissipation
P
D
500
W
Storage Temperature
T
STG
–40 to 125
°
C
Operating Temperature
T
A
-40 to 85
°
C
Soldering Temperature and Time
T
SOLDER
240°C, 10sec (Lead only)
°C
相關(guān)PDF資料
PDF描述
S71AL016D02BAWBF0 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWBF2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWBF3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWTF0 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWTF2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S71AL016D02BAWBF0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWBF2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWBF3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWTF0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWTF2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*