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| 型號(hào)： | S71AL016D02-B7 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP）的閃存和RAM |
| 文件頁(yè)數(shù)： | 57/76頁(yè) |
| 文件大?。?/td> | 909K |
| 代理商： | S71AL016D02-B7 |
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August 4, 2004 S29AL016D_00_A1_E
S29AL016D
57
A d v a n c e I n f o r m a t i o n
AC Characteristics
t
GHEL
t
WS
OE#
CE#
WE#
RESET#
t
DS
Data
t
AH
Addresses
t
DH
t
CP
DQ7#
D
OUT
t
WC
t
AS
t
CPH
PA
Data# Polling
A0 for program
55 for erase
t
RH
t
WHWH1 or 2
RY/BY#
t
WH
PD for program
30 for sector erase
10 for chip erase
555 for program
2AA for erase
PA for program
SA for sector erase
555 for chip erase
t
BUSY
Notes:
1. PA = program address, PD = program data, DQ7# = complement of the data written to the device, D
OUT
= data
written to the device.
2. Figure indicates the last two bus cycles of the command sequence.
3. Word mode address used as an example.
Figure 24. Alternate CE# Controlled Write Operation Timings
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PDF描述 |
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| S71AL016D02BAWBF0 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71AL016D02BAWBF2 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71AL016D02BAWBF3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71AL016D02BAWTF0 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71AL016D02BAWTF2 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S71AL016D02BAWBF0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71AL016D02BAWBF2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71AL016D02BAWBF3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71AL016D02BAWTF0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71AL016D02BAWTF2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
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