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參數(shù)資料
| 型號： | S29GL128N11FFIVH2 |
| 廠商： | SPANSION LLC |
| 元件分類： | PROM |
| 英文描述： | 16M X 16 FLASH 3V PROM, 110 ns, PBGA64 |
| 封裝： | 10 X 13 MM, 1 MM PITCH, LEAD FREE, FBGA-64 |
| 文件頁數(shù)： | 69/74頁 |
| 文件大?。?/td> | 1593K |
| 代理商： | S29GL128N11FFIVH2 |
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May 1, 2006 S29GL-N_01_A0
S29GL-N
69
Data
She e t
21. Physical Dimensions
21.1
FAA064—64-Ball Fortified Ball Grid Array (FBGA)
3174\38.9G
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM Z.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9
FOR PACKAGE THICKNESS, "A" IS THE CONTROLLING
DIMENSION.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, INK MARK,
METALLIZED MARKINGS INDENTION OR OTHER MEANS.
N/A
10.00 mm x 13.00 mm
PACKAGE
FAA 064
NOM.
---
1.20
---
0.78
MAX.
10.00 BSC.
13.00 BSC.
8
---
MIN.
0.64
0.30
7.00 BSC.
8
64
0.45
0.50
0.40
1.00 BSC
ME
JEDEC
PACKAGE
SYMBOL
A
A2
A1
MD
D1
D
E
E1
N
NOTE
ROW MATRIX SIZE E DIRECTION
BALL FOOTPRINT
BALL PITCH
0.50 BSC
SOLDER BALL PLACEMENT
BODY SIZE
BALL HEIGHT
BODY SIZE
BODY THICKNESS
OVERALL THICKNESS
BALL DIAMETER
ROW MATRIX SIZE D DIRECTION
TOTAL BALL COUNT
BALL FOOTPRINT
e
SD / SE
b
TOP VIEW
+0.20
-0.50
1.00
-0.50
+0.20
1.00
φ0.50
A1 ID.
E
D
B
A
SIDE VIEW
SEATING PLANE
A2
A
A1
C
0.20
C
0.08
SE
BOTTOM VIEW
A1 CORNER
φb
B
A
φ0.15 M C
M
7
6
e
SD
E1
D1
C
φ0.08
A
7
6
5
8
4
2
3
1
B
C
F
E
D
G
H
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