參數(shù)資料
型號: PPC405EX-NpAfffTx
廠商: Applied Micro Circuits Corp.
英文描述: PowerPC 405EX Embedded Processor
中文描述: 嵌入式處理器的PowerPC 405EX
文件頁數(shù): 46/67頁
文件大?。?/td> 457K
代理商: PPC405EX-NPAFFFTX
PPC405EX – PowerPC 405EX Embedded Processor
46
AMCC Proprietary
Revision 1.09 - August 21, 2007
Preliminary Data Sheet
Thermal Management
The following heat sink was used in the above thermal analysis:
26.92mm x 27mm x 11.43mm
The heat sink is manufactured by:
Aavid Thermalloy, P/N 62925
Table 8. Package Thermal Specifications
The PPC405EX is designed to operate within a case temperature range
T
C
defined in “Recommended DC Operating
Conditions” on page 47. Thermal resistance values for the EPBGA packages in a convection environment are as follows:
Parameter
Symbol
Airflow
ft/min (m/sec)
300 (1.52)
Unit
0 (0)
100 (0.51)
200 (1.02)
400 (2.02)
500 (2.53)
600 (3.03)
Junction-to-ambient
thermal resistance
without
heat sink
Junction-to-ambient
thermal resistance
with
heat sink
θ
JA
18.9
16.6
15.8
15.4
15.0
14.7
14.4
°C/W
θ
JA
15.5
12.5
11.4
10.9
10.7
10.5
10.3
°C/W
Resistance Value
Junction-to-case thermal
resistance
Junction-to-board thermal
resistance
Notes:
1. Values in the table are achieved with the following JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, T
C
, is measured at top center of case surface with device soldered to circuit board.
b. T
A
= T
C
– Px
θ
CA
, where T
A
is ambient temperature and P is power consumption.
c. T
CMax
= T
JMax
– Px
θ
JC
, where T
JMax
is maximum junction temperature and P is power consumption.
θ
JC
8.96
°C/W
θ
JB
13.74
°C/W
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