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參數(shù)資料
| 型號： | PIP201-12M |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 模擬信號調(diào)理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PQCC68 |
| 封裝： | 10 X 10 X 0.85 MM, PLASTIC, HVQFN-68 |
| 文件頁數(shù)： | 7/20頁 |
| 文件大?。?/td> | 333K |
| 代理商： | PIP201-12M |
Philips Semiconductors
PIP201-12M
DC to DC converter powertrain
Product data
Rev. 02 — 18 July 2002
15 of 21
9397 750 09833
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
15. Soldering
15.1 Introduction to soldering MLF packages
The MicroLeadFrame package (MLF) is a near Chip Scale Package (CSP) with a
copper leadframe. It is a leadless package, where electrical contact to the printed
circuit board is made through metal pads on the underside of the package. In addition
to the small pads around the periphery of the package, there are large pads on the
underside that provide low thermal resistance, low electrical resistance, low
inductance connections between the power components inside the MLF package and
the printed-circuit board. It is this feature of the MLF package that makes it ideally
suited for VRM applications.
Electrical connection between the package and the printed circuit board is made by
printing solder paste on the printed circuit board, placing the component and
reowing the solder in a convection or infra-red oven. The solder reow process is
ensure good solder joints, the peak temperature Tp should not exceed 220 °C for thin
packages such as MLF, and the time above liquidus temperature should be less than
1.25 minutes. The maximum temperature can be increased for lead free solder. The
ramp rate during preheat should not exceed 3 K/s. Nitrogen purge is recommended
during reow.
Fig 18. Typical reow soldering process ow.
Fig 19. Typical reow soldering temperature prole.
SOLDER PASTE
PRINTING
POST PRINT
INSPECTION
COMPONENT
PLACEMENT
PRE REFLOW
INSPECTION
REFLOW SOLDERING
POST REFLOW INSPECTION
(PREFERABLY X-RAY)
REWORK AND
TOUCH UP
03aj25
03aj26
0
100
200
300
01
23
time (minutes)
Temp
Tr
Te
Tp
rate of rise of
temperature < 3 K/s
1 min max
1.25 min max
(
°C)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PIP201-12M-3 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DC-to-DC converter powertrain |
| PIP201-12M-3,518 | 功能描述:IC REG BUCK SYNC ADJ 20A 68HVQFN RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - DC DC 開關(guān)穩(wěn)壓器 系列:- 標(biāo)準(zhǔn)包裝:20 系列:SIMPLE SWITCHER® 類型:降壓（降壓） 輸出類型:固定 輸出數(shù):1 輸出電壓:12V 輸入電壓:4 V ~ 60 V PWM 型:電壓模式 頻率 - 開關(guān):52kHz 電流 - 輸出:1A 同步整流器:無 工作溫度:-40°C ~ 125°C 安裝類型:通孔 封裝/外殼:16-DIP（0.300"，7.62mm） 包裝:管件 供應(yīng)商設(shè)備封裝:16-DIP 其它名稱:*LM2575HVN-12LM2575HVN-12 |
| PIP202-12M | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DC to DC converter powertrain |
| PIP202-12M-2 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DC-to-DC converter powertrain |
| PIP202-12M-2 /T3 | 功能描述:直流/直流開關(guān)轉(zhuǎn)換器 TAPE7 MOSFET RoHS:否 制造商:STMicroelectronics 最大輸入電壓:4.5 V 開關(guān)頻率:1.5 MHz 輸出電壓:4.6 V 輸出電流:250 mA 輸出端數(shù)量:2 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT |
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