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參數資料
| 型號： | PIP201-12M |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 模擬信號調理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PQCC68 |
| 封裝： | 10 X 10 X 0.85 MM, PLASTIC, HVQFN-68 |
| 文件頁數： | 4/20頁 |
| 文件大?。?/td> | 333K |
| 代理商： | PIP201-12M |
Philips Semiconductors
PIP201-12M
DC to DC converter powertrain
Product data
Rev. 02 — 18 July 2002
12 of 21
9397 750 09833
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
printed-circuit board is approximately 5 K/W. In order to take full advantage of the low
thermal resistance of this package, the printed-circuit board must be designed so that
heat is conducted away efciently from the package. This can be achieved by
maximizing the area of copper around each pad, and by incorporating thermal vias to
conduct the heat to inner and/or bottom layers of the printed-circuit board.
An example of a thermal via pattern is shown in Figure 13. In a typical application,
with no forced air cooling, the use of thermal vias typically reduces the thermal
resistance from 25 K/W to 20 K/W. The additional use of a small fan can reduce this
further to approximately 15 K/W.
The thermal resistance of a particular design can be measured by passing a known
current through the source-drain diode of the lower MOSFET. The direction of current
ow is into VSSO and out of VO. The volt drop between VSSO and VO is then
measured and used to calculate the power dissipation in the PIP201-12M. The case
temperature of the PIP201-12M can be measured using an infra-red thermometer.
The thermal resistance can then be calculated using the following equation:
(3)
where Tcase is the measured case temperature (°C), Tamb is the ambient
temperature (
°C), I is the MOSFET current (A), and VF is the voltage drop between
VSSO and VDDO (V).
Where more than one phase is used, for example the circuit of Figure 11, the thermal
resistance of each PIP201-12M should be measured with current owing in all
phases.
12. Test information
Figure 14 shows the test circuit used to measure power loss in the PIP201-12M. The
output voltage is measured using an averaging circuit. This eliminates losses in the
output inductor and the PCB tracks. The calculated power loss, using this method,
All holes 0.5 mm diameter with 1 mm spacing.
Fig 13. Printed-circuit board thermal via pattern.
03ag36
PAD1
PAD2
PAD3
R
th j
pcb
–
()
T
case
T
amb
–
IV
F
×
------------------------------- KW
()
=
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相關代理商/技術參數 |
參數描述 |
|---|---|
| PIP201-12M-3 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DC-to-DC converter powertrain |
| PIP201-12M-3,518 | 功能描述:IC REG BUCK SYNC ADJ 20A 68HVQFN RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - DC DC 開關穩(wěn)壓器 系列:- 標準包裝:20 系列:SIMPLE SWITCHER® 類型:降壓（降壓） 輸出類型:固定 輸出數:1 輸出電壓:12V 輸入電壓:4 V ~ 60 V PWM 型:電壓模式 頻率 - 開關:52kHz 電流 - 輸出:1A 同步整流器:無 工作溫度:-40°C ~ 125°C 安裝類型:通孔 封裝/外殼:16-DIP（0.300"，7.62mm） 包裝:管件 供應商設備封裝:16-DIP 其它名稱:*LM2575HVN-12LM2575HVN-12 |
| PIP202-12M | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DC to DC converter powertrain |
| PIP202-12M-2 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DC-to-DC converter powertrain |
| PIP202-12M-2 /T3 | 功能描述:直流/直流開關轉換器 TAPE7 MOSFET RoHS:否 制造商:STMicroelectronics 最大輸入電壓:4.5 V 開關頻率:1.5 MHz 輸出電壓:4.6 V 輸出電流:250 mA 輸出端數量:2 最大工作溫度:+ 85 C 安裝風格:SMD/SMT |
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