參數(shù)資料
型號(hào): PC34704BEP
廠商: FREESCALE SEMICONDUCTOR INC
元件分類(lèi): 電源管理
英文描述: 8-CHANNEL POWER SUPPLY MANAGEMENT CKT, QCC56
封裝: 7 X 7 MM, 1 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-56
文件頁(yè)數(shù): 49/50頁(yè)
文件大?。?/td> 2010K
代理商: PC34704BEP
Analog Integrated Circuit Device Data
8
Freescale Semiconductor
34704
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Battery Input Supply Voltage (VIN) Pin
PVINx, RST, ONOFF, LION, DRV7(4), VG, SCL, SDA and VOUT1-5 Pins
VDDI, COMPx, FBx, VREF7(4), FREQ, and SS Pins
VIN
-0.3 to 6.0
-0.3 to 3.0
V
SW1-5 Pins
VSW-LOW
-1.0 to 6.0
V
SW8, SW6(4) Pins
VSW-HIGH
-1.0 to 27
V
BTx Pins (Referenced to switch node)
VBT-VSW
-0.3 to 6.0
V
BTx Pins to GND
VBT
-0.3 to 27
V
VOUT8, VOUT6(4) Pins
VOUT-HIGH
-0.3 to 27
V
VOUT7 Pin(4)
VOUT-NEG
-10.0 to 0.3
V
Continuous Output Current
REG2,5
REG3
REG4
REG8
500
550
300
60
30
mA
ESD Voltage
Human Body Model
Charge Device Model
VESD1
VESD2
±1000
±500
V
THERMAL RATINGS
Maximum Junction Temperature
TJ(MAX)
+150
°C
Storage Temperature
TSTG
-65 to +150
°C
Maximum Power Dissipation (TA = 85°C)
PD
TBD
°C
THERMAL RESISTANCE
Junction to Ambient
Junction to Board
RΘJA
RΘJB
22
7
°C/W
Peak Package Reflow Temperature During Reflow(2),(3)
TPPRT
°C
Notes
1.
ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 ), and the Charge Device
Model (CDM), Robotic (CZAP = 4.0pF).
2.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
4.
Available only on the 34704A
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